Fsi International, Inc.

Tel Fsi, Inc.

Ronald J Hanestad

Thomas J Wagener

Kurt Karl Christenson

Patricia Ann Ruether

David Scott Becker

Gregory Paul Thomes

Larry D Zimmerman

James F Weygand

A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90&#xb0; C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90&#xb0; C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.

Process for removing material from substrates

Apparatus for removing material from one or more substrates

Stiction in a microstructure may be eliminated by directing a cryogenic aerosol at the portion of the microstructure subject to stiction with sufficient force so as to free the portion of the microstructure.

Eliminating stiction with the use of cryogenic aerosol

Growing community of inventors

Glenwood City, WI, United States of America

Ronald J Hanestad