Nanonexus Corporation

Roman Milter

Fu Chiung Chong

Sammy Mok

Frank Swiatowiec

Syamal Kumar Lahiri

Chang-Ming Lin

Erh-Kong Chieh

Joseph Michael Haemer

David Doan

Yi-Hsing Chen

Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in the formed stress metal springs, defining a looped spring structure. The formed springs provide high pitch compliant electrical contacts for a wide variety of interconnection systems, including chip scale semiconductor packages, high density interposer connectors, and probe contactors. Several embodiments of massively parallel interface integrated circuit test assemblies are also disclosed, comprising one or more substrates having stress metal spring contacts, to establish connections between one or more separated integrated circuits on a compliant wafer carrier.

Systems for testing and packaging integrated circuits

Enhanced stress metal spring contactor

This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Miniaturized contact spring

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San Francisco, CA, United States of America

Roman Milter