Huntsman Advanced Materials Americas LLC

Ciba-geigy Corporation

Vantico Limited

Huntsman Advanced Materials LLC

Rolf Wiesendanger

Martin Roth

Walter Fischer

Kurt Meier

Bernhard Sailer

Roger P-e Salvin

Adrian Schulthess

Max Hunziker

Manfred Hofmann

Bernd Klingert

Isabelle Frischinger

Claudio A Gabutti

Paul Bernhard

Bettina Steinmann

Michael Reisinger

Bryan Dobinson

Compounds of formula Ia or Ib wherein A is an (n+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and n is an integer from 0 to 5,

Amine hardener for epoxy resins

Epoxy acrylates of the formulae (A), (B) and epoxy acrylate mixtures comprising at least one of the compounds (A) or (B) are novel and find use in coating materials or adhesives featuring high UV stability 

Uv-curable epoxy acrylates

A carboxyl group-containing epoxy acrylate is prepared by the reaction of an epoxy resin advanced with an aromatic biphenol compound which is reacted with a polycarboxylic acid anhydride in the presence or absence of a catalyst and a polymerization inhibitor at an elevated temperature. The carboxyl group-containing epoxy acrylate is mixed with a photoinitiator to obtain a photoresist formulation.

Epoxy acrylate of aromatic biphenol-advanced epoxy resin reacted with anhydride

Polymercaptopolyamines as epoxy resin hardeners

Epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Epoxy acrylates

Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Transaminated dialkylaminoalkylphenol-3&deg; and 1&deg; amine-containing compound

Curable epoxy resin compositions

A process is described for the preparation of photopolymerizable compositions, wherein the photopolymerizable compositions can be photopolymerized by the irradiation of emission lines of differing wavelength from a UV/VIS laser light source, and contain a photopolymerizable compound and at least two photoinitiators, by adjusting the sensitivity to radiation. The ratio between the concentrations of the individual photoinitiators is so adjusted that the composition has virtually the same optical density for the radiation of the different emission lines at which the photoinitiators are effective.

Process for adjusting the sensitivity to radiation of photopolymerizable

Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

A liquid photosensitive composition comprising

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Riehen, Switzerland

Rolf Wiesendanger