Pri Automation, Inc.

Rodney C Ow

Martin P Aalund

Steve Reyling

J Rafael Gomez

Lang Van Nugyen

Craig Chidlow

Steven J Remis

Karl Mathia

A substrate handling system with integrated door removal assembly for an environmentally controlled substrate processing chamber is provided. The system includes a robot positioned within the chamber. A drive mechanism is connected to the robot. A door interface mechanism is attached to the drive mechanism and includes a door key and a door key control assembly. The drive mechanism provides mechanical control of the door key control assembly such that that door key is manipulated to couple a substrate carrier door to a port door. The coupled doors are storable within the chamber or on the robot. The drive mechanism may also include a substrate end effector, thereby allowing the robot to transport substrates within the chamber. The robot is movable within the chamber to multiple processing stations.

Apparatus and method for using a robot to remove a substrate carrier door

A wafer carrier adapter for use with a 200 millimeter wafer carrier and a pod door opener to a front end of a semiconductor processing environment. The 200 millimeter wafer carrier has a bottom surface and is provided with a plurality of recesses extending through the bottom surface in a predetermined configuration and a front opening for accessing silicon wafers in the wafer carrier. The pod door opener has a platform with a kinematic coupling which includes a plurality of pins extending upwardly in a predetermined pattern from the platform for aligning and supporting 300 millimeter wafer carriers relative to a port in the pod door opener. The wafer carrier adapter comprises a support structure having top and bottom surfaces. The support structure is provided with a plurality of recesses extending through the bottom surface adapted to receive the plurality of pins. The plurality of recesses of the support structure correspond in number to the plurality of pins and are arranged in a pattern corresponding to the predetermined pattern of pins for precisely aligning the support structure relative to the plurality of pins. The top surface has a plurality of protuberances adapted for disposition in the plurality of recesses of the 200 millimeter wafer carrier. The plurality of protuberances are arranged in a configuration relative to the plurality of recesses of the 200 millimeter wafer carrier for precisely aligning the 200 millimeter wafer carrier relative to the plurality of pins so that the front opening of the 200 millimeter wafer carrier faces the port.

Wafer carrier adapter and method for use thereof

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Cupertino, CA, United States of America

Rodney C Ow