Hewlett-packard Development Company, L.p.

Rocky H Knuth

Rio Rivas

Siddhartha Bhowmik

Mark C Huth

The described embodiments relate to substrates having features formed therein and methods of forming same. One exemplary method forms a blind feature through a majority of a thickness of a substrate, the blind feature being defined by at least one sidewall surface and a bottom surface. The method also applies an etch resistant material to the blind feature and removes the etch resistant material from at least a portion of the bottom surface. The method further wet etches the substrate at least through the bottom surface sufficient to form a through feature through the thickness of the substrate.

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Lebanon, OR, United States of America

Rocky H Knuth