Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Solvay Sa

Robert Wieland

Martin Richter

Martin Wackerle

Michael Pittroff

Dieter Bollmann

Henry Leistner

Jamila Boudaden

An embodiment is an electrostatic micro-pump including a diaphragm arrangement including a diaphragm and a first electrode structure. The electrostatic micro-pump further includes a valve arrangement, including an inlet check valve and an outlet check valve, wherein the diaphragm arrangement and the valve arrangement at least partially enclose a pump chamber. The electrostatic micro-pump further includes a second electrode structure arranged so as to form an electrostatic drive with the first electrode structure. The electrostatic drive is configured to deflect the diaphragm. The electrostatic micro-pump further includes at least one anti-stiction bump arranged between the first electrode structure and the second electrode structure, wherein in an inactive state of the micro-pump, a spacing between the first electrode structure and the second electrode structure varies towards a center region of the pump chamber when starting from a peripheral region of the pump chamber, wherein the peripheral region encloses the center region.

Electrostatic micro-pump and a process to produce an electrostatic micro-pump

The present invention relates to a process for cleaning chambers of apparatus used for semiconductor manufacturing with a gas mixture comprising or consisting of fluorine, nitrogen and argon as well as said gas mixtures.

Process for etching, and chamber cleaning and a gas therefor

The present invention relates to a bipolar carrier wafer and a mobile, bipolar electrostatic wafer arrangement. Carrier wafers and wafer arrangements of this type can be used in particular in the field of handling technology of semiconductor wafers. The carrier wafer according to the invention serves for mounting a disc-shaped semiconductor component. It has a first surface () as front-side and a second surface () which is situated opposite the first surface () as rear-side. The carrier wafer is configured such that it has a carrier layer (), an electrically insulating cover layer () which surrounds the carrier layer and an electrically conductive layer (), the latter being disposed on the electrically insulating cover layer and being structured in at least two regions which are separated from each other electrically as electrodes. Electrical contacts are disposed on the rear-side () of the carrier wafer, these electrical contacts being connected to the two electrodes disposed on the front-side (). On the electrically conductive layer (), in addition an electrically insulating cover layer () is disposed which covers both the front-side () and the edge of the carrier wafer between the front-side () and the rear-side ().

Bipolar carrier wafer and mobile bipolar electrostatic wafer arrangement

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Munich, Germany

Robert Wieland