Growing community of inventors

Cupertino, CA, United States of America

Robert Shinagawa

Average Co-Inventor Count = 7.50

ph-index = 6

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 95

Robert ShinagawaChristopher F Bevis (9 patents)Robert ShinagawaCharles L Chen (9 patents)Robert ShinagawaHaiguang Chen (9 patents)Robert ShinagawaKurt Lehman (9 patents)Robert ShinagawaAnantha R Sethuraman (9 patents)Robert ShinagawaRonald L Allen (9 patents)Robert ShinagawaChing Ling Meng (9 patents)Robert ShinagawaThanassis Trikas (9 patents)Robert ShinagawaAbdurrahman Sezginer (1 patent)Robert ShinagawaHsu-Ting Huang (1 patent)Robert ShinagawaRobert Shinagawa (10 patents)Christopher F BevisChristopher F Bevis (54 patents)Charles L ChenCharles L Chen (36 patents)Haiguang ChenHaiguang Chen (30 patents)Kurt LehmanKurt Lehman (19 patents)Anantha R SethuramanAnantha R Sethuraman (16 patents)Ronald L AllenRonald L Allen (13 patents)Ching Ling MengChing Ling Meng (13 patents)Thanassis TrikasThanassis Trikas (9 patents)Abdurrahman SezginerAbdurrahman Sezginer (108 patents)Hsu-Ting HuangHsu-Ting Huang (9 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Kla-tencor Technologies Corporation (9 from 641 patents)

2. Tokyo Electron Limited (1 from 10,295 patents)


10 patents:

1. 8831767 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

2. 8010222 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

3. 7332438 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

4. 7230703 - Apparatus and method for measuring overlay by diffraction gratings

5. 7175503 - Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device

6. 7052369 - Methods and systems for detecting a presence of blobs on a specimen during a polishing process

7. 7030018 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

8. 6935922 - Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing

9. 6884146 - Systems and methods for characterizing a polishing process

10. 6866559 - Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad

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as of
12/6/2025
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