Infineon Technologies Ag

Robert Muhr

Walter Leitgeb

Matthias Fehr

Nicolas Siedl

A method of detecting adhesive residue on a wafer after peeling an adhesive film from the wafer by using a peeling tape is described. According to a first aspect, the method includes illuminating the peeling tape with first UV light after the peeling and acquiring a fluorescence image from the peeling tape. According to a second aspect, the method includes illuminating the wafer with second UV light after the peeling and acquiring a fluorescence image from the wafer.

Detection of adhesive residue on a wafer

An inspection method for semiconductor substrates using slope data and corresponding inspection apparatus are provided. The inspection method includes recording, by using an inspection apparatus, first data from measuring points in an inspection area of a main surface of a semiconductor substrate. The inspection area winds around a center point of the main surface. The first data includes information about a slope of the main surface at the measuring points along a first direction that deviates from a direction tangential to a circle that contains the measuring point and that has its center in the center point by not more than &#xb1;60&#xb0;. A data processing apparatus analyzes the first data to obtain position data of locations on the main surface, at which the first data fulfills predetermined criteria. The position data is output through a data interface unit.

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Villach, Austria

Robert Muhr