Delphi Technologies, Inc.

Delco Electronics Corporation

Robert Lawrence Healton

John Carl Christenson

Douglas Ray Sparks

Ronald E Brown

Steven Edward Staller

John Emmett Freeman

Troy Allan Chase

David Boyd Rich

A semiconductor wafer is etched to create an array of MEMS devices and at the same time, test sites having geometry which represent critical geometry of the MEMS devices. Probe contacts are provided in the test sites to permit measurement of resistance and capacitance between test site geometry as a way of determining the effectiveness of the etch. One test site comprises a ladder of semiconductor structures separated by gaps of graded width. Another test site comprises finger structures formed over a cavity and the probe contacts are located so as to detect inter-finger capacitance and resistance (or continuity) as well as intra-finger resistance.

Method and apparatus for electrically testing and characterizing formation of microelectric features

A micro-electro-mechanical structure including a semiconductor layer mounted to an annular support structure via an isolation layer wherein the semiconductor layer is micromachined to form a suspended body having a plurality of suspension projections extending from the body to the rim and groups of integral projections extending toward but spaced from the rim between said suspension projections. Each projection in said groups has a base attached to the body and a tip proximate the rim. The structure includes a plurality of inward projections extending from and supported on the rim and toward the body. Each such projection has a base attached to the rim and a tip proximate the body; wherein the grouped projections and the inward projections are arranged in an interdigitated fashion to define a plurality of proximate projection pairs independent of the suspension elements such that a primary capacitive gap is defined between the projections of each projection pair. Also, a process is disclosed for fabricating the micro-electro-mechanical structure including the steps of removing a highly doped etch termination layer and thereafter etching through a lightly doped epitaxial layer to thereby define and release the structure.

MEMS sensor structure and microfabrication process therefor

A method is disclosed for micromachining the surface of a silicon substrate which encompasses a minimal number of processing steps. The method involves a preferential etching process in which a chlorine plasma etch is capable of laterally etching an N+ buried layer beneath the surface of the bulk substrate. Such a method is particularly suitable for forming sensing devices which include a small micromachined element, such as a bridge, cantilevered beam, membrane, suspended mass or capacitive element, which is supported over a cavity formed in a bulk silicon substrate. The method also permits the formation of such sensing devices on the same substrate as their controlling integrated circuits. This invention also provides novel methods by which such structures can be improved, such as through optimizing the dimensional characteristics of the micromachined element or by encapsulating the micromachined element.

Micromachined integrated pressure sensor with oxide polysilicon cavity

A method for micromachining the surface of a silicon substrate which encompasses a minimal number of processing steps. The method involves a preferential etching process in which a chlorine plasma etch is capable of laterally etching an N+ buried layer beneath the surface of the bulk substrate. Such a method is particularly suitable for forming sensing devices which include a small micromachined element, such as a bridge, cantilevered beam, membrane, suspended mass or capacitive element, which is supported over a cavity formed in a bulk silicon substrate. The method also permits the formation of such sensing devices on the same substrate as their controlling integrated circuits. This invention also provides novel methods by which such structures can be improved, such as through optimizing the dimensional characteristics of the micromachined element or by encapsulating the micromachined element.

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Kokomo, IN, United States of America

Robert Lawrence Healton