Asml Netherlands B.v.

Asml Masktools B.v.

Asml Holding N.v.

Asml Masktooks B.v.

Robert John Socha

Donis George Flagello

Jang Fung Chen

Douglas Van Den Broeke

Xuelong Shi

Steve Hansen

Arie Jeffrey Den Boef

Nitesh Pandey

Franciscus Godefridus Casper Bijnen

Youping Zhang

Edo Maria Hulsebos

Henricus Johannes Lambertus Megens

James Sherwood Greeneich

Johannes Jacobus Matheus Baselmans

Patricius Aloysius Jacobus Tinnemans

Arno Jan Bleeker

Hugo Augustinus Joseph Cramer

Duan-Fu Stephen Hsu

Paul Christiaan Hinnen

Hong M Chen

Christopher A Spence

Yi Zou

Kars Zeger Troost

Thomas Laidig

Thomas Ingolf Wallow

Anton Bernhard Van Oosten

Jiangwei Li

Jing Su

Robertus Cornelis Martinus De Kruif

Jean-Pierre Agnes Henricus Marie Vaessen

Luoqui Chen

Markus Schluter

Steven G Hansen

A measurement apparatus and method for determining a substrate grid describing a deformation of a substrate prior to exposure of the substrate in a lithographic apparatus configured to fabricate one or more features on the substrate. Position data for a plurality of first features and/or a plurality of second features on the substrate is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. The substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus for controlling at least part of an exposure process to fabricate one or more features on the substrate.

Measurement apparatus and a method for determining a substrate grid

A method of adjusting a metrology apparatus, the method including: spatially dividing an intensity distribution of a pupil plane of the metrology apparatus into a plurality of pixels; and reducing an effect of a structural asymmetry in a target on a measurement by the metrology apparatus on the target, by adjusting intensities of the plurality of pixels.

Adjustment of a metrology apparatus or a measurement thereby based on a characteristic of a target measured

A method includes obtaining a sub-layout having an area that is a performance limiting spot, adjusting colors of patterns in the area, and determining whether the area is still a performance limiting spot. Another method includes decomposing patterns in a design layout into multiple sub-layouts; determining for at least one area in one of the sub-layouts, the likelihood of that a figure of merit is beyond its allowed range; and if the likelihood is above a threshold, that one sub-layout has a performance limiting spot. Another method includes: obtaining a design layout having a first group of patterns and a second group of patterns, wherein colors of the first group of patterns are not allowed to change and colors of the second group of patterns are allowed to change; and co-optimizing at least the first group of patterns, the second group of patterns and an illumination of a lithographic apparatus.

Coloring aware optimization

An illumination source is optimized by changing the intensity and shape of the illumination source to form an image in the image plane that maximizes the minimum ILS at user selected fragmentation points while forcing the intensity at the fragmentation points to be within a small intensity range. An optimum mask may be determined by changing the magnitude and phase of the diffraction orders to form an image in the image plane that maximizes the minimum ILS at user selected fragmentation points while forcing the intensity at the fragmentation points to be within a small intensity range. Primitive rectangles having a size set to a minimum feature size of a mask maker are assigned to the located minimum and maximum transmission areas ad centered at a desired location. The edges of the primitive rectangle are varied to match optimal diffraction orders O(m,n). The optimal CPL mask O(x,y) is then formed.

Source and mask optimization by changing intensity and shape of the illumination source and magnitude and phase of mask diffraction orders

Disclosed herein is a method comprising: obtaining a plurality of measurement results from a pattern on a substrate respectively using a plurality of substrate measurement recipes, the substrate processed by a lithography process; reconstruct, using a computer, the pattern using the plurality of measurement results, to obtain a reconstructed pattern.

Metrology by reconstruction

A process of calibrating a model, the process including: obtaining training data including: scattered radiation information from a plurality of structures, individual portions of the scattered radiation information being associated with respective process conditions being characteristics of a patterning process of the individual structures; and calibrating a model with the training data by determining a ratio relating a change in one of the process characteristics to a corresponding change in scattered radiation information.

Optical metrology of lithographic processes using asymmetric sub-resolution features to enhance measurement

An inspection method determines values of profile parameters of substrate patterns. A baseline substrate with a baseline pattern target (BP) is produced that has a profile described by profile parameters, for example CD (median critical dimension), SWA (side wall angle) and RH (resist height). Scatterometry is used to obtain first and second signals from first and second targets. Values of differential pattern profile parameters are calculated using a Bayesian differential cost function based on a difference between the baseline pupil and the perturbed pupil and dependence of the pupil on pattern profile parameters. For example, the difference is measured between a baseline process and a perturbed process for stability control of a lithographic process. Fed-forward differential stack parameters are also calculated from observations of stack targets on the same substrates as the pattern targets.

Inspection method and apparatus, lithographic system and device manufacturing method

Disclosed is a method of monitoring a focus parameter during a lithographic process. The method comprises acquiring first and second measurements of, respectively first and second targets, wherein the first and second targets have been exposed with a relative best focus offset. The method then comprises determining the focus parameter from first and second measurements. Also disclosed are corresponding measurement and lithographic apparatuses, a computer program and a method of manufacturing devices.

Inspection apparatus, inspection method, lithographic apparatus, patterning device and manufacturing method

Methods, computer program products and apparatuses for optimizing design rules for producing a mask are disclosed, while keeping the optical conditions (including but not limited to illumination shape, projection optics numerical aperture (NA) etc.) fixed. A cross-correlation function is created by multiplying the diffraction order functions of the mask patterns with the eigenfunctions from singular value decomposition (SVD) of a TCC matrix. The diffraction order functions are calculated for the original design rule set, i.e., using the unperturbed condition. ILS is calculated at an edge of a calculated image of a critical polygon using the cross-correlation results and using translation properties of a Fourier transform. Once an optimum separation is calculated, it is incorporated into the design rule to optimize the mask layout for improved ILS throughout the mask.

Rule optimization in lithographic imaging based on correlation of functions representing mask and predefined optical conditions

The Hessian (second derivative) of the image log slope (ILS) can be quickly and accurately calculated without the need to use approximate methods from the gradient of the ILS with respect to mask transmission and source intensity. The Hessian has been traditionally calculated using a finite-difference approach. Calculating the Hessian through a finite-difference approach is slow and is an approximate method. The gradient of the ILS improves the speed of calculation of the Hessian, and thus accelerated SMO operation is realized. The results of ILS evaluation can be used in design for manufacturing (DFM) to suggest changes in the design rules to improve imaging. For a fixed illumination, this information can help remove forbidden pitches and help select design rules for 1-D and 2-D patterns on a mask design layout.

Determining the gradient and Hessian of the image log slope for design rule  optimization for accelerating source mask optimization (SMO)

A method of decomposing a target pattern having features to be imaged on a substrate so as to allow said features to be imaged in a multi-exposure process. The method includes the steps of: segmenting a plurality of the features into a plurality of polygons; determining the image log slope (ILS) value for each of the plurality of polygons; determining the polygon having the minimum ILS value, and defining a mask containing the polygon; convolving the defined mask with an eigen function of a transmission cross coefficient so as to generate an interference map, where the transmission cross coefficient defines the illumination system to be utilized to image the target pattern; and, assigning a phase to the polygon based on the value of the interference map at a location corresponding to the polygon, where the phase defines which exposure in said multi-exposure process the polygon is assigned.

Method, program product and apparatus for model based geometry decomposition for use in a multiple exposure process

Methods, computer program products and apparatuses for optimizing design rules for producing a mask are disclosed, while keeping the optical conditions (including but not limited to illumination shape, projection optics numerical aperture (NA) etc.) fixed. A cross-correlation function is created by multiplying the diffraction order functions of the mask patterns with the eigenfunctions from singular value decomposition (SVD) of a TCC matrix. The diffraction order functions are calculated for the original design rule set, i.e., using the unperturbed condition. ILS is calculated at an edge of a calculated image of a critical polygon using the cross-correlation results and using translation properties of a Fourier transform. The use of the calculated cross-correlation of the mask and the optical system, and the translation property of the Fourier transform for perturbing the design reduces the computation time needed for determining required changes in the design rules. Once an optimum separation is calculated, it is incorporated into the design rule to optimize the mask layout for improved ILS throughout the mask, including critical and non-critical portions of the mask.

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Campbell, CA, United States of America

Robert John Socha