Lockheed Martin Corporation

Lockhead Martin Corp.

Robert G Davies

Donald Franklin Foust

Kanti N Patel

William Francis Nealon

R Mark Clark

Dennis Mlynarski

Charles E Crepeau

A helix radiating element is disclosed. The helix radiating element includes a support, a base and a helix wire. The support is made up of a dielectric material including a PEEK (Polyetheretherketone) material. The base is coupled to the support and is made up of boron nitride. The helix wire is configured to be wrapped around the support and bonded to the base. The base is coupled to a ground plane. A boron nitride filled adhesive is used to bond the support to the base and bond the helix wire to the base. The boron nitride filled adhesive is also used to bond the base to the ground plane. Heat generated in the helix wire is transferred to the ground plane via the base.

Helix radiating elements for high power applications

Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of applying adhesion promoter to a clean surface of the substrate, and curing the adhesion promoter. SPIE varnish is applied over the cured adhesion promoter, and is itself cured. A further layer of adhesion promoter is applied over the cured SPIE varnish, and is cured. The polyimide dielectric material is then laminated to the adhesion promoter. Cleaning of the copper-containing substrate portions is performed by etching with etchant including cupric chloride, cleaning of the titanium-containing substrate portions is performed with etchant including HF, and cleaning of copper- and titanium-containing portions is performed by HF etching followed by cupric chloride etching. Aluminum-containing portions of the substrate are not etched.

Polymide-to-substrate adhesion promotion in HDI

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Pennsauken, NJ, United States of America

Robert G Davies