1. International Business Machines Corporation (78 from 164,108 patents)

2. Adeia Semiconductor Bonding Technologies Inc. (5 from 1,853 patents)

3. Globalfoundries Inc. (4 from 5,671 patents)

4. Infineon Technologies Ag (2 from 14,705 patents)

5. Other (1 from 832,680 patents)

6. United Microelectronics Corp. (1 from 7,074 patents)

7. Infineon Technologies North America Corp. (1 from 244 patents)

8. Adeia Semiconductor Solutions LLC (1 from 19 patents)

9. United Microelectronics Co. (1 from 4 patents)

10. United Mircroelectronics Co. (1 from 1 patent)

1. 12327730 - Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic

2. 11978639 - Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic

3. RE49794 - SRAM design to facilitate single fin cut in double sidewall image transfer process

4. 11699591 - Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic

5. 11295995 - Testing SRAM structures

6. 11062911 - Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic

7. 10910041 - SRAM cell with dynamic split ground and split wordline

8. 10804148 - Buried contact to provide reduced VFET feature-to-feature tolerance requirements

9. 10796957 - Buried contact to provide reduced VFET feature-to-feature tolerance requirements

10. 10755773 - SRAM cell with dynamic split ground and split wordline

11. 10699775 - SRAM cell with dynamic split ground and split wordline

12. 10629258 - SRAM cell with dynamic split ground and split wordline

13. 10621295 - Incorporation of process variation contours in design rule and risk estimation aspects of design for manufacturability to increase fabrication yield

14. 10614877 - 4T static random access memory bitcell retention

15. 10573528 - Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic