Insystems, Inc.

Robert B Howe

Lawrence H Lin

Daniel L Cavan

Victor A Scheff

In an imaging system (10) for detecting defects in a specimen (14) having a repetitive pattern (16), a spatial filter (50) receives a spatial frequency spectrum produced by a Fourier transform lens (34) and blocks preselected spatial frequency components thereof. The spatial filter includes an array of substantially parallel opaque stripes (70a-70c) that are positioned on a substantially transparent substrate (72). In one embodiment, the stripes are spaced apart by equal distances (78) and are of increasing widths (76a-76c) that correspond to the orders of diffraction of the Fourier transform pattern (45) produced by the Fourier transform lens. The spatial filter can be used to filter light spots forming a Fourier transform pattern for specimens having repetitive pattern sizes included within a specified range of sizes.

Spatial filter for optically based defect inspection system

An inspection system (10, 100) employs a Fourier transform lens (34, 120) and an inverse Fourier transform lens (54, 142) positioned along an optic axis (48, 144) to produce from an illuminated area of a patterned specimen wafer (12) a spatial frequency spectrum whose frequency components can be selectively filtered to produce an image pattern of defects in the illuminated area of the wafer. Depending on the optical component configuration of the inspection system, the filtering can be accomplished by a spatial filter of either the transmissive (50) or reflective (102) type. The lenses collect light diffracted by a wafer die (14) aligned with the optic axis and light diffracted by other wafer dies proximately located to such die. The inspection system is useful for inspecting only dies having many redundant circuit patterns. The filtered image strikes the surface of a two-dimensional photodetector array (58) which detects the presence of light corresponding to defects in only the illuminated on-axis wafer die. Inspection of all possible defects in the portions of the wafer surface having many redundant circuit patterns is accomplished by mounting the wafer onto a two-dimensional translation stage and moving the stage (40) so that the illuminated area continuously scans across the wafer surface from die to die until the desired portions of the wafer surface have been illuminated. The use of a time delay integration technique permits continuous stage movement and inspection of the wafer surface in a raster scan fashion.

Growing community of inventors

San Jose, CA, United States of America

Robert B Howe