Dionex Corporation

Richard L Bersin

Richard F Reichelderfer

James F Battey

James H Junkin

Joseph M Welty

Process and apparatus for carrying out a reaction, such as etching aluminum, in the glow discharge of a gas plasma. The plasma is formed between a pair of closely spaced electrodes, and a distributed impedance is provided in series with the plasma to assure uniform distribution of the ionizing current and the glow discharge of the plasma throughout the region between the electrodes.

Gas plasma reactor and process

Process for etching SiO.sub.2 with hydrogen fluoride gas, utilizing an organic material such as negative photoresist as a catalyst. In one embodiment, the negative photoresist is applied directly to the portions of the SiO.sub.2 to be removed, and in another the negative photoresist is spaced away from the SiO.sub.2. In some embodiments, positive photoresist is applied to the portions of the SiO.sub.2 which are to be retained.

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San Lorenzo, CA, United States of America

Richard L Bersin