Novellus Systems Incorporated

Lam Research Corporation

Richard K Lyons

Christopher M Bartlett

Steven T Mayer

Jingbin Feng

Eric G Webb

R Marshall Stowell

Edmund Minshall

Avishai Kepten

John B Alexy

Norman D Kaplan

Mark T Winslow

Peter S Thaulad

Brandon L Senn

Daniel Mark Dinneen

Christian DiPietro

Gustavo G Francken

Zhuozhi Chen

David Mark Dinneen

A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.

Vision-based wafer notch position measurement

A main reservoir holds cool reactant liquid. A reaction vessel for treating a substrate is connected to the main reservoir by a feed conduit. A heater is configured to heat reactant liquid in the feed conduit before the liquid enters the reaction vessel. Preferably, the heater is a microwave heater. A recycle conduit connects the reaction vessel with the main reservoir. Preferably, a recycle cooler cools reactant liquid in the recycle conduit before the liquid returns to the main reservoir. Preferably, an accumulation vessel is integrated in the feed conduit for accumulating, heating, conditioning and monitoring reactant liquid before it enters the reaction vessel. Preferably, a recycle accumulator vessel is integrated in the recycle conduit to accommodate reactant liquid as it empties out of the reaction vessel.

Electroless plating-liquid system

During fluid treatment of a substrate surface, a carrier/wafer assembly containing a substrate wafer closes the top of a microcell container. The carrier/wafer assembly and the container walls define a thin enclosed treatment volume that is filled with treating fluid, such as electroless plating solution. The thin fluid-treatment volume typically has a volume in a range of about from 100 ml to 500 ml. Preferably a container is heated and the treating fluid is pre-heated before being injected into the container. Preferably, the chemical composition, temperature, and other properties of fluid in the thin enclosed fluid-treatment volume are dynamically variable. A rinse shield and a rinse nozzle are located above the container. A carrier/wafer assembly in a rinse position substantially closes the top of the rinse shield.

Small-volume electroless plating cell

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Sandy, OR, United States of America

Richard K Lyons