Vishay Sprague, Inc.

Tessera Technologies Hungary Kft.

Vishay-siliconix

Vishay Intertechnology, Inc.

Aligena Ag

Membrane Products Kiryat Weizmann Ltd.

Membrane Products Kiryat Weitzman Ltd.

Shell Case Limited

Membrane Products Kiryat Weizman Ltd.

Membrane Products Kiryat Weisman, Ltd.

Reuven Katraro

Charles Linder

Mara Nemas

Mordechai Perry

Gil Zilber

Vage Oganesian

Julia Aksenton

Nissim Cohen

Kyle Terrill

Deva N Pattanayak

Kuo-In Chen

King Owyang

Haim Goldberger

Robert Xu

Qufei Chen

Kam Hong Lui

Mohammed Kasem

Ronald Wong

Eli Bershadsky

Calvin Choi

John Bultitude

Alex Eidelman

David Ben-Bassat

Dani Alon

Steve Breithaupt

Marina Kravchik-Volfson

Marina Kravchik

Doron Gozaly

Lilia Kushnarev

Doron Teomim

Henia Yacubowicz

A semiconductor device (e.g., a flip chip) includes a substrate layer that is separated from a drain contact by an intervening layer. Trench-like feed-through elements that pass through the intervening layer are used to electrically connect the drain contact and the substrate layer when the device is operated.

Semiconductor device with trench-like feed-throughs

An electrolytic capacitor includes a metal case, a porous pellet anode disposed within the metal case, an electrolyte disposed within the metal case, and a cathode element formed of an electrophoretically deposited metal or metal oxide powder of a uniform thickness disposed within the metal case and surrounding the anode. A method of manufacturing an electrolytic capacitor includes providing a metal case, electrophoretically depositing on the metal can a refractory metal oxide to form a cathode element, and placing a porous pellet anode and an electrolyte within the can such that the cathode element and the anode element being separated by the electrolyte.

Electrophoretically deposited cathode capacitor

A bulk capacitor includes a first electrode formed of a metal foil and a semi-conductive porous ceramic body formed on the metal foil. A dielectric layer is formed on the porous ceramic body for example by oxidation. A conductive medium is deposited on the porous ceramic body filling the pores of the porous ceramic body and forming a second electrode. The capacitor can then be encapsulated with various layers and can include conventional electrical terminations. A method of manufacturing a bulk capacitor includes forming a conductive porous ceramic body on a first electrode formed of a metal foil, oxidizing to form a dielectric layer and filling the porous body with a conductive medium to form a second electrode. A thin semi-conductive ceramic layer can also be disposed between the metal foil and the porous ceramic body.

Bulk capacitor and method

A dielectric ceramic composition has a dielectric constant, K, of at least 200 and a dielectric loss, DF, of 0.0006 or less at 1 MHz. The dielectric ceramic composition may be formed by sintering by firing in air without a controlled atmosphere. The dielectric ceramic composition may have a major component of 92.49 to 97.5 wt. % containing 60.15 to 68.2 wt. % strontium titanate, 11.02 to 23.59 wt. % calcium titanate and 7.11 to 21.32 wt. % barium titanate; and a minor component of 2.50 to 7.51 wt. % containing 1.18 to 3.55 wt. % calcium zirconate, 0.50 to 1.54 wt. % bismuth trioxide, 0.2 to 0.59 wt. % zirconia, 0.02 to 0.07 wt. % manganese dioxide, 0.12 to 0.35 wt. % zinc oxide, 0.12 to 0.35 wt. % lead-free glass frit, 0.24 to 0.71 wt. % kaolin clay and 0.12 to 0.35 wt. % cerium oxide. UHF antennas and monolithic ceramic components may use the dielectric ceramic composition.

Ceramic dielectric formulation for broad band UHF antenna

An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.

Methods and apparatus for packaging integrated circuit devices

An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode. A first bottom electrode termination is positioned in the first opening and a second bottom electrode termination is positioned in the second opening. The first bottom electrode termination is electrically connected to the first electrode and the second bottom electrode termination is electrically connected to the second electrode. A standoff is positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the electronic component when mounted. The standoff provides resistance to tilting.

High precision capacitor with standoff

A surface mount chip capacitor includes a metal substrate, a conductive powder element including a valve metal and partially surrounding the metal substrate with the metal substrate extending outwardly from the conductive powder towards the anode end of the surface mount chip capacitor, a silver body cathode at least partially surrounding the conductive powder element, a coating formed by vapor-phase deposition surrounding the silver body cathode, an insulative material formed about a portion of the substrate extending outwardly from the conductive powder, a conductive coating formed around the metal substrate at the anode end of the surface mount chip capacitor, an end termination anode electrically connected to the conductive coating at the anode end of the surface mount chip capacitor, and an end termination cathode electrically connected to the silver body cathode at the cathode end of the surface mount chip capacitor.

Surface mount chip capacitor

A crystalline substrate based device including a crystalline substrate having formed thereon a microstructure and at least one packaging layer which is formed over the microstructure and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer and at least one opening in the packaging layer communicating with the at least one gap.

Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby

The invention provides a process for producing a tubular membrane assembly comprising helically winding at least one strip of fibrous material on a mandrel to produce at least a single ply tubular support member for a semi-permeable membrane, characterized by passing the strip through a heated section of the mandrel during the helical winding thereof to flatten and smooth fibers protruding along the cross-sectional width of the strip, whereby a tube with a smooth inner bore along its entire length is formed.

Process for producing a tubular membrane assembly

The invention provides a multistage membrane system for the recovery of solvents and solutes from chromatographic systems, including first means for directing a first fluid stream of a main eluting fraction, containing target molecules to be concentrated and solvent, to a first filtration membrane unit for concentration and recovery of the target molecules at the feed side of the first membrane; second means for directing fluid streams of other eluting fractions of the chromatographic process, containing contaminants and solvent, to a second filtration membrane unit for concentration and collection of the contaminant solutes at the feed side of the second membrane unit; and third means for directing filtered solvent coming from the permeate side of the first filtration unit to the feed side of the second filtration membrane unit, whereby the filtered solvent intermixes with the fluid stream of other eluting fractions.

Multi-stage membrane system and process

A composite membrane comprises a substrate made from a polymer selected from copolymers and homopolymers of ethylenically unsaturated nitriles, which substrate has preferably first been treated with a pore protector in absence of curing agents and catalysts therefor, prior to applying as the final coating a silicone layer, which is crosslinked. The pore protector, which may be, for example, a hydroxy-terminated polysiloxane, particularly a silanol-terminated polysiloxane, serves the dual purpose of preventing the pores from collapsing, when the support is dried during the curing of the silicone layer, and of preventing passage of the coating material deeply into the pores and thus also preventing an undue reduction of the flux of the finished coated membrane. Such composite membranes include solvent stable membranes which swell to an extent of no more than about 10% when immersed in various organic solvents, and their mixtures with each other and/or water.

Silicon-derived solvent stable membranes

A composite membrane which is substantially insoluble (and preferably swells no more than 10%) in acetonitrile, ethanol, hexane, toluene, N-methylpyrrolidone, dimethylsulfoxide, dimethylformamide, dimethylacetamide, and their mixtures with each other and/or with water, comprises a substrate made from copolymers or homopolymers of ethylenically unsaturated nitriles, the substrate having been subjected to the steps of: (1) insolubilizing the polymer by crosslinking; (2) coating with a silicone layer; and (3) crosslinking the silicone layer. Prior to step (2), the substrate is preferably treated with a pore protector in absence of curing agents and catalysts. The pore protector is e.g. a hydroxy-terminated polysiloxane, particularly a silanol-terminated polysiloxane; it prevents the pores from collapsing, when the support is dried during step (3), and prevents passage of the coating material deeply into the pores, thus also preventing an undue reduction of the flux of the finished membrane.

Silicone-derived solvent stable membranes

Growing community of inventors

Rishon Lezion, Israel

Reuven Katraro