Infineon Technologies Ag

Renate Bergmann

Thomas Happ

Jan Boris Philipp

Georg Braun

Heinz Hoenigschmid

Thomas Roehr

Christine Dehm

G&uuml;nther Schindler

A memory cell includes a first electrode, a second electrode, and phase-change material between the first electrode and the second electrode. The phase-change material defines a narrow region. The memory cell includes first insulation material having a first thermal conductivity and contacting the phase-change material. A maximum thickness of the first insulation material contacts the narrow region. The memory cell includes a second insulation material having a second thermal conductivity greater than the first thermal conductivity and contacting the first insulation material.

Integrated circuit having an insulated memory

The invention provides a method. In a first step of a method for fabricating a ferroelectric memory configuration, there is provided a substrate having a multiplicity of memory cells. Each of the memory cells has at least one select transistor, at least one short-circuit transistor, and at least one ferroelectric capacitor. The transistors are connected in an electrically conductive manner to a first of the electrodes of the ferroelectric capacitor. In the next step, at least one electrically insulating layer is applied. In the next step, at least one contact hole for connecting a second electrode of the ferroelectric capacitors is produced. Next, contact holes for connecting the short-circuit transistors are produced. Next, the contact holes are filled with electrically conductive material. Next, an electrically conductive layer is applied and patterned, so that the second electrodes of the ferroelectric capacitors are each conductively connected to the short-circuit transistors.

Method for fabricating a ferroelectric memory configuration

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Yorktown Heights, NY, United States of America

Renate Bergmann