Ebara Corporation

Rei Kiumi

Fumio Kuriyama

Nobutoshi Saito

Masaaki Kimura

Takashi Takemura

Hiroshi Yokota

Masashi Shimoyama

Yugang Guo

Sachiko Takeda

A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.

Plating method and apparatus

A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.

Plating apparatus

The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn&#x2014;Ag solder alloy having an adjusted Ag content, and a method of forming the lead-free bump. The lead-free bump of the present invention is obtained by forming an Sn&#x2014;Ag alloy film having a lower Ag content than that of an Sn&#x2014;Ag eutectic composition by plating and reflowing the plated alloy film.

Lead free bump and method of forming the same

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Tokyo, Japan

Rei Kiumi