International Business Machines Corporation

Toppan Printing Co., Ltd.

Raymond Walter Jeffer

Brian Neal Caldwell

James P Levin

Steven C Nash

Yuki Fujita

Joseph L Malenfant, Jr

Louis M Kindt

Daniel Boyd Sullivan

Aspects of the present invention relate to a test photomask and a method for evaluating critical dimension changes in the test photomask. Various embodiments include a test photomask. The test photomask includes a plurality of cells having a varied density pattern. The plurality of cells include a first group of cells arranged along a first line, the first group of cells having a first combined density ratio. The plurality of cells also include a second group of cells arranged along a second line, the second group of cells having a second combined density ratio. In the plurality of cells, the second combined density ratio for the second group of cells is equal to the first combined density ratio of the first group of cells. The varied density pattern is configured to substantially neutralize fogging effects.

Test pattern layout for test photomask and method for evaluating critical dimension changes

The present invention comprises a system, software, and method for the treatment of mask data that produces defects in resultant images produced in the fabrication of a mask, following identification of the defects. The invention involves identifying each exposure shot with certain information which when combined with similar information related to the defects is used to control the exposure tool to toggle or modulate the shots related to the defects and thus, eliminate the defects.

Method of compensating for defective pattern generation data in a variable shaped electron beam system

Disclosed is an electrostatic chuck and system for maintaining a device flat within the electrostatic chuck. The electrostatic chuck has a plate, height adjustment mechanisms connected to the plate; and electrostatic chuck pins connected to the height adjustment mechanisms. The system provides a measurement tool adapted to measure the flatness of the device held by the electrostatic chuck pins and a computer connected to the height adjustment mechanisms and the measurement tool. The computer adjusts the flatness of the device by adjusting the height adjustment mechanisms based on feedback from the measurement tool. The computer is adapted to change the shape of the device to conform to a pre-existing standard.

Adaptive electrostatic pin chuck

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South Burlington, VT, United States of America

Raymond Walter Jeffer