Brewer Science, Inc.

Nissan Chemical Industries Limited

Ram W Sabnis

Terry Lowell Brewer

Douglas J Guerrero

Mary J Spencer

Yoshitane Watanabe

James E Lamb, Iii

Kiyomi Ema

Akira Yanagimoto

Yasuhisa Sone

Edith G Hays

Michael D Stroder

Wu-Sheng Shih

Jonathan W Mayo

Robert E Nichols

Novel processes of applying a thin, uniform, conformal organic polymeric film by a wide variety of deposition processes into lithography pattern substrates are provided. The inventive processes result in shrinking of the gaps in the lithography pattern equally, thus producing a smaller dimension. The amount of pattern shrinkage is selectively controlled by controlling the deposition rate to provide the desired final structure dimension. A wide variety of organic films is used as materials for these films. The inventive methods are applicable to any patterning technique used in lithography to provide a reduction in pattern sizes. Examples of the applicable device levels include the production of gate layers, ion implantation of active device layers and substantive metal layers, dielectric patterning, interconnect processes produced by damascene, dual damascene, backend packaging layers, and devices requiring multiple layers deposited by electrodeposition, CVD or sputtering. The inventive methods are useful for providing highly conformal coatings on large surface substrates having super submicron (i.e., 0.15 &#x3bc;m or smaller) features. The process is environmentally friendly and relatively low cost compared to other options.

Lithography pattern shrink process and articles

An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 &#x3bc;m or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.

Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition

An improved method for applying organic antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise chemical vapor depositing (CVD) an antireflective compound on the substrate surface. In one embodiment, the compound is highly strained (e.g., having a strain energy of at least about 10 kcal/mol) and comprises two cyclic moieties joined to one another via a linkage group. The most preferred monomers are [2.2](1,4)-naphthalenophane and [2.2](9,10)-anthracenophane. The CVD processes comprise heating the antireflective compound so as to vaporize it, and then pyrolizing the vaporized compound to form stable diradicals which are subsequently polymerized on a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large substrate surfaces having super submicron (0.25 &#x3bc;m or smaller) features.

Organic polymeric antireflective coatings deposited by chemical vapor deposition

An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The PECVD processes comprise providing a quantity of a polymer generated by introducing monomer vapors into a plasma state followed by polymerization thereof, with assistance of plasma energy, onto the surface of a substrate. The most preferred starting monomers are phenylacetylene, 4-ethynyltoluene, and 1-ethynyl-2-fluorobenzene. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 &#x3bc;m or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.

A high optical density, i.e., .gtoreq.3.0, at 1 micron or less film thickness, black matrix is disclosed having improved stability and shelf life as a consequence of admixing Pigment Black 7 and organic dye or dye mixtures on a polyimide polymer vehicle.

High optical density ultra thin organic black matrix system

An organic black matrix having high resistivity (.gtoreq.10.sup.11 ohm/square), high optical density (.gtoreq.2.0) at ultra thin film thicknesses (.ltoreq.1.0 microns) for improved STN and TFT pixel display applications is made possible by combining polyimide/dye solutions and mixed metal oxide pigment dispersions at a weight/weight ratio of dye to pigment of 1:15 to 3:15. The need for low resistivity carbon black, as a replacement for sputtered chrome, is negated.

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Evansville, IN, United States of America

Ram W Sabnis