Suss Microtec Test Systems Gmbh

Ralph Juettner

Stefan Kreissig

Karsten Stoll

Axel Schmidt

Joerg Kiesewetter

Hans-Juergen Fleischer

A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.

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Dresden, Germany

Ralph Juettner