Wolff Walsrode Ag

Other

Ralf M Hartmann

Rainer Brandt

Christian Kuckertz

Sven Jacobsen

Klaus Landes

Peter P Chow

Masahiko Shibata

Don G Klein

A material source evaporator for use with an evacuable interior deposition chamber in which evaporated materials are deposited on substrates comprising a container with an associated heater that can heat an vaporizable material provided in the container to provide a vapor thereof. A manifold having a plurality of output apertures also has an associated heater that can heat the material vapor provided in the manifold to remain sufficiently vaporous to pass out of output apertures which are in a selected pattern to provide a calibrated spatial distribution of material vapor that results in a deposition thereof in a layer on an adjacent substrate in a fixed position. Thus, the layer has a relatively uniform thickness.

Thin-film deposition evaporator

Described is a method of treating or coating homogeneously at least a portion of the surface of a material selected from metallic materials having a thickness of less than 100 &mgr;m and/or polymeric materials. The method of the present invention comprises exposing at least a portion of the surface of the material to an atmospheric plasma generated by an indirect plasmatron. In the method of the present invention, the surface of the material may undergo at least one of an increase in surface tension, a surface grafting, a surface cleaning and a surface sterilization.

Method of surface treating or coating of materials

Described is a process for the homogeneous surface activation of a material in web form, by means of plasma-treatment. The material in web form is selected from metallic materials in web form having a thickness of less than 100 &mgr;m, polymeric materials in web form and combinations thereof. The process involves treating homogeneously at least a portion of the surface of the material in web form, which is moved over at least one pair of rolls, with an atmospheric plasma, optionally in the presence of a process gas and/or a process aerosol. The atmospheric plasma is generated by an indirect plasmatron.

Process for the surface activation of materials

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Richfield, MN, United States of America

Ralf M Hartmann