Semiconductor Technologies & Instruments Pte. Ltd.

Texas Instruments Corporation

Rajiv Roy

Charles K Harris

Weerakiat Wahawisan

Clyde Maxwell Guest

Michael C Zemek

Paul Harris Hasten

Michael D Glucksman

Thomas J Doty

Troy D Moore

Dennis Lee Doane

James E Loveless

Dennis M Botkin

Thomas Casey Carrington

George Charles Epp

Joe Douglas Woodall

Younes Chtioui

Joseph Antao

A system for inspecting a component, such as a die formed on a silicon wafer, is provided. The system includes a two dimensional inspection system that can locate one or more features, such as bump contacts on the die, and which can also generate feature coordinate data. The system also includes a three dimensional inspection system that is connected to the two dimensional inspection system, such as through an operating system of a processor. The three dimensional inspection system receives the feature coordinate data and generates inspection control data.

System and method for inspecting bumped wafers

A system for selecting reference die images, such as for use with a visual die inspection system, is provided. The system includes a die image comparator, which compares a first die image to a second die image in order to create a difference image that contains only the differences between the two die images. The system also includes a difference image analysis system that receives data from the die image comparator. The difference image analysis system analyzes the difference image and determines whether there are any features of the difference image that indicate that either the first die image or the second die image should not be used as a reference die image.

System and method for selection of a reference die

A computer vision apparatus and methods for automatically inspecting 2-dimensional (2D) and 3-dimensional (3D) criteria of objects using a single camera and laser sources. A camera views the object under inspection which is illuminated by a first source of light to highlight the region of interest. This provides image data for 2d analysis by a computer coupled to the system. Subsequently, multiple laser sources mounted on a positioner provide the illumination for collecting images for 3 dimensional analysis. A computer with a monitor is connected to the camera to perform the inspection and analysis and for operator supervision of the system. Specific implementations provided refer to embodiments for inspecting packaged semiconductor devices such as Ball-Grid Arrays (BGAs) packages and Quad Flat Packages (QFPs) packages for package mark inspection, package defect inspection, and solder ball or lead defects. Further, the apparatus and methods of the invention can be applied to the inspection of chip sized packages and to Flip-Chip Bump, and I.C. Die inspection. The system can also be used to inspect bond wire Wire Loop Height and to perform automated Quality Inspection for critical assembly of disk-drives, CD-Roms, keyboards, other assemblies in the computer industry and in other industries.

Method and apparatus for inspecting a workpiece

A device (10) identifies a defective object (12) from an image of the object (12) stored as pixel data in a pixel-data memory (52, 54, 56, 58). An inspection-point memory (72, 74, 76, 78) stores inspection-point data for the object (12). The inspection-point data represents inspection points (122, 124, . . . ) that are arranged in circuital (112, 136) and transverse (110) groups, where member inspection points of the circuital groups (112, 136) are also members of different ones of the transverse groups (110). A program memory (84) stores a program, which is executed by a processor (64, 66, 68, 70). The processor (64, 66, 68, 70) identifies which of the pixel data correspond to the inspection-point data, calculates differences between values of the corresponding pixel data within the circuital groups (112, 136), identifies a deviant pixel (116) if one of the differences exceeds a first threshold, calculates gradients of values of the corresponding pixel data within the transverse group (110a) including the deviant pixel and within at least one other transverse group (110b, 110c), and determines whether the gradients of the transverse group (110a) differs by more than a second threshold from the gradient of the other transverse group (10b, 10c).

Apparatus and method for identifying defective objects

A system for transporting and inspecting, seriatim, semiconductor devices with plural prong type or solder ball type leads includes a head for transporting the semiconductor devices from one support structure, such as a tray or tube, to a second support structure, such as a tray or tape, and wherein two dimensional and three dimensional measurements of the positional accuracy of the leads is carried out during the transport process. The inspection apparatus is interposed in the transport path and includes a first optical sensor such as a CCD camera oriented to capture a two dimensional image of the semiconductor device package and compare the image with a predetermined two dimensional image store in a central processing unit (CPU). A high intensity light source, such as a laser, generates a plane of light which is reflected off of the semiconductor device leads to a second optical sensor, also comprising a CCD camera, wherein a so-called three dimensional image is generated to be compared by the CPU with predetermined or calculated positional relationships of the leads to establish coplanarity of the lead tips, or lack thereof. The system includes a sensor located such that the semiconductor device is centered in a field of view of the cameras to capture the respective images. The transport head may be rotated to correct for improper positioning of the device prior to generation of the three dimensional image. The system may interchangeably inspect semiconductor device packages with prong leads extending from one or all sides of a rectangular substrate as well an array of solder ball leads supported on a substrate. A modified arrangement of the inspection system is adapted for inspecting multiple semiconductor devices with solder ball leads and supported on wafer type substrates.

Inspection system and method for leads of semiconductor devices

A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the leads (74). A conditioning tool (20) includes conditioner arm (34) and conditioner blade (70) that selectively contacts a predetermined number of the leads (74). A manipulator (22) moves conditioning tool (20) to positions that contact a predetermined number of leads (74) to condition leads (74). A control system (24) controls the operation of manipulator (22).

Programmable lead conditioner

Burr inspection system (120) inspects an electrical lead for a burr (112) in association with the operation of a machine vision lead inspection system (10) and includes machine vision circuitry (50) for forming an image (70) of the electrical lead (72) using machine vision lead inspection system (10). Edge detecting instructions (120) associate with machine vision circuitry (50) for determining a plurality of edges (89, 91) associated with the electrical lead (72). Scan line determining instructions (128) calculate a plurality of scan lines (88, 90) each corresponding to the contour of a selected one of the plurality of edges (89, 91). The scan lines (88, 90) are separated from edges (88, 90) and image (70) by a preselected distance (92). Inspecting circuitry (130) inspects each scan line (88, 90) to detect whether a burr image (112) crosses the scan line (88, 90) to determine the presence of a burr on the electrical lead.

Method and system for inspecting integrated circuit lead burrs

The invention is to a system and apparatus for determining the planarity of leads on a semiconductor device. An image system is used to locate the leads with reference to a reference plate on which the device is mounted, and a real-time reference which is used to provide a known correlation between image pixels and linear measurement such as mils.

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Plano, TX, United States of America

Rajiv Roy