Lam Research Ag

Sez Ag

Rainer Obweger

Thomas Wirnsberger

Andreas Gleissner

Franz Kumnig

Alexander Lippert

Ulrich Tschinderle

Ivan L Berry, Iii

Harald F Okorn-Schmidt

Philipp Engesser

Christian Thomas Fischer

Rafal Ryszard Dylewicz

Alexander Pfeuffer

Martin Köffler

Franz Kumning

Nathan Lavdovsky

Mu Hung Chou

Alessandro Baldaro

Michael Dalmer

Harry Sax

Frank Werfel

A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.

Method and apparatus for processing wafer-shaped articles

A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.

Apparatus for treating surfaces of wafer-shaped articles

An apparatus for processing wafer-shaped articles, comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber, and comprises a lower surface facing inwardly of the chamber. At least one heating element heats the lower surface of the lid to a desired temperature, so as to prevent condensation of process vapor on the inwardly facing surface of the lid.

A device for measuring the distribution and/or impulse of a series of droplets comprises a piezoelectric sensor positioned relative to a source of droplets such that each of a plurality of droplets contacts the piezoelectric sensor in succession, thereby to generate an electrical signal. Logic circuitry is configured to calculate one or more frequencies from the electrical signal.

Device for measuring the distribution or impulse of a series of droplets

An apparatus for treating a surface of an article includes a chamber for receiving an article to be treated. A dispenser dispenses a treatment liquid including inorganic acid onto the article. A tank stores the treatment liquid. An ozone generator communicates with a supply line entering or exiting the tank to mix ozone with the treatment liquid. A cooler cools the treatment liquid to a subambient temperature in a range of 3&#xb0; C. to less than 20&#xb0; C. A heater heats a surface of an article to be treated to a temperature at least 30&#xb0; C. greater than a temperature of the treatment liquid when applied to the article.

Method and apparatus for surface treatment using inorganic acid and ozone

A device for processing wafer-shaped articles comprises a rotary chuck having a series of pins adapted to hold a wafer shaped article on the rotary chuck. Each of the pins comprises a cylindrical body and a projecting gripping portion formed integrally therewith. The cylindrical body and gripping portion are made from a ceramic material. The gripping portion comprises cylindrical surfaces having a common generatrix with surfaces of the cylindrical body.

Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device

An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber. The lid comprises an annular chamber, gas inlets communicating with the annular chamber and opening on a surface of the lid facing outwardly of the closed process chamber, and gas outlets communicating with the annular chamber and opening on a surface of the lid facing inwardly of the closed process chamber.

A device for fluid treatment of a plate-like article includes a rotary head for holding and rotating a plate-like article around a substantially vertical rotation axis

Device for fluid treating plate-like articles

A device for treating a disc-like article with a fluid, including elements for dispensing a fluid onto the article and a chuck for holding and rotating the article around an axis perpendicular thereto, the chuck including a base body, a drive ring, and gripping members for contacting the article at its edge. The gripping members are eccentrically movable with respect to the center of the article and driven by a drive ring rotatably mounted to the base body so that the drive ring is rotatable against the base body around the axis. The relative rotational movement of the drive ring against the base body is carried out by either holding the base body and rotating the drive ring or by holding the drive ring and rotating the base body, whereby the to-be-held-part (drive ring or base body) is held without touching the respective to-be-held-part by magnetic force.

Device for treating disc-like articles

A device for supporting and rotating a disc-like article includes:

Device for treating disc-like article and method for operating same

Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30&#xb0; C. higher than the temperature of the acid ozone mixture.

A device for holding wafer-shaped articles, such as semiconductor wafers, is equipped with a series of pins that are brought into contact with a peripheral edge of the wafer-shaped article, under control of a common gear ring or a series of conjointly operated gear sectors. In the regions of the gear ring or gear sectors engaging the pin assemblies, those elements are designed to yield more readily than other regions of the gear ring or gear sectors, to accommodate differential thermal expansion of the chuck components in the vicinity of the pin assemblies.

Device for holding wafer shaped articles

Disclosed is a method and a respective apparatus for ultrasonic wet treatment of a plate-like article, which comprises: bringing a solid element, which is connected to a transducer in close proximity to a surface of a plate-like article so that a gap is formed between the solid element and the plate-like article, the gap having a distance dbetween 0.1 mm and 5 mm, dispensing liquid for filling the gap between the solid element and the plate-like article, and detecting ultrasonic waves and/or controlling the distance d, by measuring the distance d, comparing the measured distance with a desired distance dand adjusting the distance accordingly.

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Lind Im Drautal, Austria

Rainer Obweger