Applied Materials, Inc.

Raijiro Koga

Fred Conrad Redeker

Brian J Brown

Boris Fishkin

Gee Sun Hoey

Takashi Kumagai

Hiromi Tsuruta

Suzuki Kenji

Bruce Lu

Roland Shu

K Y Wang

Rex Lu

The present invention generally provides an apparatus and a method for conditioning a polishing pad in a polishing system. In one embodiment, the apparatus includes a conditioning disk having conditioning elements disposed on the bottom surface and away from the center portion of the disk. In another embodiment, the apparatus includes a base plate and a ring-shaped plate in which the conditioning elements are disposed on the ring-shaped plate. In still another embodiment, the apparatus includes a conditioning disk having conditioning elements disposed on the bottom surface and away from the center portion of the disk and having brush bristles disposed on the center portion of the disk.

Conditioning disk for conditioning a polishing pad

A chemical mechanical polishing apparatus includes a pad conditioner having a conditioner head, a cleaning cup for receiving and cleaning the conditioner head of the pad conditioner, and a fluid dispenser for dispensing a cleaning fluid onto the conditioner head.

Pad conditioner cleaning apparatus

A cleaning cup for holding and cleaning a pad conditioner having a conditioner head, the cleaning cup includes a spray nozzle for spraying a cleaning solution on a top side of the conditioner head. The cleaning cup further includes a plurality of support pins extending upwards from a base of the cleaning cup to receive the conditioner head thereon.

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Tsuchiura, Japan

Raijiro Koga