Samsung Electronics Co., Ltd.

Pyung-moon Zhang

Sang-Hoon Shin

Yong-Sik Park

Ki-hyun Park

Seung-ho Ok

Jin-wook Lee

Chang-Rae Kim

A built-in self-test (BIST) circuit and a method of operating BIST circuit is disclosed. The BIST circuit is configured to generate a test pattern based on a plurality of test parameters including a first test parameter and a second test parameter and perform a test on at least one memory core. The method includes setting a sweep range comprising a sweep start point of the first test parameter and a sweep end point thereof; generating a first test pattern corresponding to each sweep point of the sweep range from the sweep start point of the first test parameter and the sweep end point thereof and providing the first test pattern to the at least one memory core; receiving output data corresponding to the first test pattern from the at least one memory core and comparing the output data and a predetermined reference data; and generating first test result information based on results of the comparing.

Built-in self-test (BIST) circuit, memory device including the same, and method of operating the BIST circuit

A built-in self-test (BIST) circuit and a method of operating BIST circuit is disclosed. The BIST circuit is configured to generate a test pattern based on a plurality of test parameters and perform a test on at least one memory core. The method includes setting a sweep range including a sweep start point of a first test parameter and a sweep end point thereof; generating a first test pattern corresponding to each sweep point of the sweep range from the sweep start point of the first test parameter and the sweep end point thereof and providing the first test pattern to the at least one memory core; receiving output data corresponding to the first test pattern from the at least one memory core and comparing the output data and a predetermined reference data; and generating first test result information based on results of the comparing.

A semiconductor memory device includes an internal clock generator configured to generate an internal clock signal having a first clock period in response to a chip enable signal and change the first clock period of the internal clock signal in response to a clock control signal, and a controller configured to receive external commands including the chip enable signal and generate the clock control signal corresponding to a first external command other than the chip enable signal. Here, the semiconductor memory device performs a data input/output operation in response to the internal clock signal with the changed clock period.

Semiconductor memory device with reduced power noise

Provided are a semiconductor memory device, memory system and method of executing a bootloading operation. The method includes cyclically executing a bootloading operation cycle that includes loading the boot information from the memory to the controller, and performing an ECC operation on the boot information. The ECC operation provides a fail condition indication or a pass condition indication and if the fail condition indication is provided, the next bootloading operation cycle is executed.

Memory device and system with cyclic, ECC-corrected bootloading operation during voltage bring up

Disclosed is a NAND flash memory device comprising a memory cell array connected to a page buffer via a plurality of bitlines. The page buffer stores input data to be programmed in the memory cell array. The memory cell array is programmed by establishing bitline voltages for the plurality of bitlines according to the input data and then applying a wordline voltage to the memory cell array. The bitline voltages are established by first precharging the bitlines to a power supply voltage and then selectively discharging the bitlines according to the input data. The bitlines are discharged sequentially, i.e., some of the bitlines are discharged before others.

Growing community of inventors

Yongin-si, South Korea

Pyung-moon Zhang