Applied Materials, Inc.

Preetham Prahallada Rao

Kartik Bhupendra Shah

Nyi O Myo

Shu-Kwan Danny Lau

Prashanth Kothnur

Brian Hayes Burrows

Lit Ping Lam

Ian Ong

A method includes measuring a subset of property values within a manufacturing chamber during a process performed on a substrate within the manufacturing chamber. The method further includes determining property values in the manufacturing chamber at locations removed from the locations the measurements are taken. The method further includes performing a corrective action based on the determined properties.

Virtual measurement of conditions proximate to a substrate with physics-informed compressed sensing

Embodiments described herein generally relate to apparatus for fabricating semiconductor devices. A gas injection apparatus is coupled to a first gas source and a second gas source. Gases from the first gas source and second gas source may remain separated until the gases enter a process volume in a process chamber. A coolant is flowed through a channel in the gas injection apparatus to cool the first gas and the second gas in the gas injection apparatus. The coolant functions to prevent thermal decomposition of the gases by mitigating the influence of thermal radiation from the process chamber. In one embodiment, the channel surrounds a first conduit with the first gas and a second conduit with the second gas.

Chamber injector

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Morgan Hill, CA, United States of America

Preetham Prahallada Rao