Esilicon Corporation

Marvell Asia Pte., Ltd.

Prasad Subramaniam

Ferran Martorell

Rakesh Chadha

Hao Nham

Hai Phuong

An integrated circuit includes a first set of dies, each die comprising circuitry and a second set of interposer dies. At least two dies of the first set of dies are connected to each other via at least one of the interposer dies. The at least one of the interposer dies includes first connections connected to a first die of the first set of dies, second connections connected to a second die of the first set of dies, and buffers connected between the first connections and the second connections. The buffers are configured to condition signals between the first die and the second die.

High density low power interconnect using 3D die stacking

An electronic circuit is implementing using a first logic die, a second logic die, and an interposer array connecting the first logic die to the second logic die. The first logic die includes an array of output contacts. The second logic die includes an array of input contacts. The interposer array includes a plurality of interposer dice. Each interposer die includes a plurality of input contacts and a plurality of output contacts. The array of output contacts of the first logic die is bonded to at least a subset of input contacts from the plurality of input contacts of an interposer die of the plurality of interposer dice. The array of input contacts of the second logic die is bonded to at least a subset of output contacts from the plurality of output contacts of the interposer die of the plurality of interposer dice.

Memory optimization of integrated circuit (IC) design using generic memory models is presented. One method includes accessing a register transfer level (RTL) description for the IC design that includes generic memory interface calls to generic memory models for each memory instance. The generic memory call interface includes a set of memory parameters. The method also includes processing the RTL description of the IC design as a step in a design flow for the IC design by processing specific memory models for the memory instances, wherein the specific memory model for each memory instance is generated from the generic memory model using the memory parameters corresponding to the memory instance. The method can also include generating specific memory models (e.g., simulation model, timing model, and layout model) for each memory instance based on a given set of values of memory parameters for the memory instance.

Memory optimization in VLSI design using generic memory models

Designing memories in VLSI design using specific memory models generated from generic memory models

Generating specific memory models using generic memory models for designing memories in VLSI design

In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

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New Providence, NJ, United States of America

Prasad Subramaniam