Carl Zeiss Smt Gmbh

Philipp Huethwohl

Thomas Korb

Jens Timo Neumann

Dirk Zeidler

Christof Riedesel

Christian Wojek

Wolfgang Hoegele

Joaquin Correa

Jagdish Chandra Saraswatula

Raghavendra Hanumantha Nayak

A method, including: recording plural images of an object by scanning plural particle beams across the object and detecting signals generated by the particle beams, wherein the plural particle beams are generated by a multi-beam particle microscope; determining plural regions of interest; determining plural image regions in each of the recorded images; determining plural displacement vectors; and determining image distortions based on image data of the recorded images and the determined displacement vectors.

Method of recording an image using a particle microscope

A method includes controlling a multi-scanning electron microscope, mSEM, to capture a first image of a wafer attached to a motorized handling stage while the motorized handling stage is in a first position. The first image includes at least a part of a notch of the wafer. The method also includes determining a radial axis of the wafer based on the first image, and controlling the motorized handling stage to shift the wafer along the radial axis by half a diameter of the wafer so that the motorized handling stage is in a second position. The method further includes controlling the mSEM to capture a second image of the wafer while the motorized handling stage is in the second position. The second image includes wafer structures. In addition, the method includes determining a reference position of the wafer based on a structure recognition of the wafer structures of the second image, and registering a wafer coordinate system of the wafer to a stage coordinate system of the motorized handling stage based on the reference position and the radial axis.

Multi-scanning electron microscopy for wafer alignment

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Ulm, Germany

Philipp Huethwohl