Leica Microsystems Lithography Gmbh

Vistec Electron Beam Gmbh

Peter Hahmann

Dirk Beyer

Thomas Elster

Dorothee Krauhs

Eckart Bergmann

Method for exposing a layout comprising multiple layers on a wafer

The invention concerns a method for exposing a substrate ( ) equipped with an n-layer photoresist system ( ), an electrically conductive connection being created between a ground potential and the substrate ( ) and/or at least one of the layers S through S of the photoresist system ( ). The invention furthermore concerns an arrangement for carrying out said method. According to the present invention, what is achieved in a single process step is that by way of spring elements E through E , a contact tip K is advanced as far as the layer S , a contact tip K is advanced through the layer S as far as the layer S , a contact tip K is advanced through the layer S and S as far as the layer S , and so forth. The electrical charges from the layer S are dissipated to the ground potential via the contact tip K , the charges from the layer S via the contact tip K , etc., and/or and from the substrate ( ) via a contact tip K .

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Jena-Drackendorf, Germany

Peter Hahmann