Shanghai Micro Electronics Equipment (group) Co., Ltd.

Shanghai Micro Electronics Equipment Co., Ltd.

Pengli Zhang

Fan Wang

Wen Kang Xu

Hailiang Lu

Junwei Jia

Hongji Zhou

An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) () carried on a workpiece stage () and includes: a plurality of detectors () for capturing images of the OUI (); a plurality of light sources () for illuminating the OUI () in different illumination modes; and a synchronization controller () signal-coupled to both the plurality of detectors () and the plurality of light sources (). The synchronization controller () is configured to directly or indirectly control the plurality of detectors () and the plurality of light sources () based on the position of the OUI () so that each of them is individually activated and deactivated according to a timing profile, that each of the detectors () is able to capture images of the OUI () in an illumination mode provided by a corresponding one of the light sources (), and that when any one of the light sources () is illuminating the OUI (), only the one of the detectors () corresponding to this light source () is activated. Through the timing control over the multiple light sources () and detectors () by the synchronization controller (), inspection with multiple measurement configurations can be accomplished within a single scan, resulting in a significant improvement in inspection efficiency.

Automatic optical inspection device and method

An apparatus and method for die defect detection are disclosed. The apparatus includes: a light source unit () for emitting light of at least two wavelengths; a beam splitter () for receiving the light emitted by the light source unit () and splitting it into a first portion and a second portion, the first portion of the light reflected by a die () surface under inspection and thereby forming a detection beam; a reference unit () for receiving the second portion of the light and processing it into a reference beam; and a detection unit () for receiving the detection beam and the reference beam. The reference beam crosses the detection beam at an angle and thus produces interference fringes on a sensing surface of the detection unit (), based on which a defect parameter of the die () surface under inspection is determined. This apparatus is capable of measuring a die with improved accuracy and efficiency and is suitable for the measurement of large dies.

Chip defect detection device and detection method

An off-axis alignment system includes, sequentially along a transmission path of a light beam, an illumination module (), an interference module () and a detection module (). The interference module () includes: a polarization beam splitter () having four side faces, the illumination module () and the detection modules () both located on a first side of the polarization beam splitter (); a first quarter-wave plate () and a first reflector (), sequentially disposed on a second side opposite to the first side; and a second quarter-wave plate () and a cube-corner prism (), sequentially disposed on a third side of the polarization beam splitter (); and a third quarter-wave plate (), a second reflector () and a lens (), sequentially disposed on a fourth side of the polarization beam splitter (). The second reflector () is located on a rear focal plane of the lens (). A center of a bottom of the cube-corner prism () is situated on an optical axis of the lens (). An off-axis alignment method is also disclosed.

Growing community of inventors

Shanghai, China

Pengli Zhang