National Taiwan University

Lenghways Technology Co., Ltd.

Pei-Zen Chang

Chih-Kung Lee

Wen-Jong Wu

Jung-Tang Huang

Shiming Lin

Long-Sun Huang

Chia-Yu Lin

Shuen-Chen Shiue

Chau-Chung Wu

Chuin-Shan Chen

Chih-Chiang Cheng

Lung-Jieh Yang

Chi-Yu Huang

Te-Son Kuo

Hung-Hsuan Lin

Ying-Tsuen Liou

Jyh-Perng Chiu

Chu-Wann Lin

An ultrasonic distance-measuring sensor assembly and an ultrasonic distance-measuring sensor thereof are disclosed. The ultrasonic distance-measuring sensor includes at least two piezoelectric actuators and a member. The member includes a side wall, at least two vibration generating/receiving surfaces and a partition. The vibration generating/receiving surfaces accommodate the piezoelectric actuators as sources. The side wall surrounds the vibration generating/receiving surfaces. The partition is disposed between the vibration generating/receiving surfaces and includes a slot. The slot is disposed between the vibration sending/receiving surfaces.

Ultrasonic distance-measuring sensor with gap and partition between vibrating surfaces

A sensor system of a surface plasmon resonance (SPR) for analyzing a characteristic of a substance and the measuring method thereof are provided. The system includes an optical device for generating a first light beam and a second light beam in sequence; a sensor device for respectively generating a first plasmon wave and a second plasmon wave in response to an optical characteristic change of the first light beam and the second light beam with respective to the substance, in which a resonance is generated from the first plasmon wave and the second plasmon wave respectively generating a first reflective signal and a second reflective signal; and a measuring device for measuring spectra of the first reflective signal and the second reflective signal and obtaining the measured value which is substituted into an operational formula to calculate a reference value used for analyzing the characteristic of the substance.

Sensor system of surface plasmon resonance (SPR) and measuring method thereof

A micro-electromechanical (MEM) process for fabrication of integrated multi-frequency communication passive components is fused into co-fired ceramics by way of &ldquo;flip chip&rdquo; for fabrication of a low-cost, high-performance, and high-reliability hybrid communication passive component applicable in the frequency range of 0.9 GHz&tilde;100 GHz. The basic structure of the passive component is a double-layer substrate comprising a low-loss ceramic or glass bottom-layer substrate and a glass or plastic poly-molecular top-layer substrate and an optional ceramic substrate at the lowest layer. As the materials used and the processing temperature in the MEM process is compatible with the CMOS process, thus this invention is fit for serving as a post process following the CMOS process.

Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components

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Taipei, Taiwan

Pei-Zen Chang