Hitachi Global Storage Technologies Netherlands B.v.

Hitachi Global Storage Technologies Amsterdam B.v.

Pei Cheh Chen

Yongjian Sun

Cherngye Hwang

Diana Perez

Jorge Goitia

Bigal Leung

Laurence S Samuelson

Omar Eduardo Montero Camacho

A method for increasing etch depth uniformity in ion milling process in a wafer manufacturing process encompasses loading designated regions of a production pallet with carriers containing wafers to be ion milled. These designated regions have been predetermined to exhibit similar and preferred depths of etching. Non-designated regions of the production pallet are then loaded with dummy carriers and the wafers are ion milled.

Method and apparatus for increasing uniformity in ion mill process

Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.

Direct cooling pallet assembly for temperature stability for deep ion mill etch process

Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.

Direct cooling pallet tray for temperature stability for deep ion mill etch process

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Campbell, CA, United States of America

Pei Cheh Chen