Euv Llc.

Paul Andrew Spence

Avijit K Ray-Chaudhuri

Michael P Kanouff

Jim Jihchyun Chang

Kenneth L Blaedel

Samuel L Thompson

Neal Robert Fornaciari

A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a &ldquo;pin&rdquo; chuck, thereby reducing the probability of entrapping a particle.

Compliant layer chucking surface

It has been demonstrated that debris generation within an electric capillary discharge source, for generating extreme ultraviolet and soft x-ray, is dependent on the magnitude and profile of the electric field that is established along the surfaces of the electrodes. An electrode shape that results in uniform electric field strength along its surface has been developed to minimize sputtering and debris generation. The electric discharge plasma source includes: (a) a body that defines a circular capillary bore that has a proximal end and a distal end; (b) a back electrode positioned around and adjacent to the distal end of the capillary bore wherein the back electrode has a channel that is in communication with the distal end and that is defined by a non-uniform inner surface which exhibits a first region which is convex, a second region which is concave, and a third region which is convex wherein the regions are viewed outwardly from the inner surface of the channel that is adjacent the distal end of the capillary bore so that the first region is closest to the distal end; (c) a front electrode positioned around and adjacent to the proximal end of the capillary bore wherein the front electrode has an opening that is communication with the proximal end and that is defined by a non-uniform inner surface which exhibits a first region which is convex, a second region which is substantially linear, and third region which is convex wherein the regions are viewed outwardly from the inner surface of the opening that is adjacent the proximal end of the capillary bore so that the first region is closest to the proximal end; and (d) a source of electric potential that is connected across the front and back electrodes.

Electrode configuration for extreme-UV electrical discharge source

A pedestal optical substrate that simultaneously provides high substrate dynamic stiffness, provides low surface figure sensitivity to mechanical mounting hardware inputs, and constrains surface figure changes caused by optical coatings to be primarily spherical in nature. The pedestal optical substrate includes a disk-like optic or substrate section having a top surface that is coated, a disk-like base section that provides location at which the substrate can be mounted, and a connecting cylindrical section between the base and optics or substrate sections. The optic section has an optical section thickness,/optical section diameter ratio of between about 5 to 10 mm, and a thickness variation between front and back surfaces of less than about 10%. The connecting cylindrical section may be attached via three spaced legs or members. However, the pedestal optical substrate can be manufactured from a solid piece of material to form a monolith, thus avoiding joints between the sections, or the disk-like base can be formed separately and connected to the connecting section. By way of example, the pedestal optical substrate may be utilized in the fabrication of optics for an extreme ultraviolet (EUV) lithography imaging system, or in any optical system requiring coated optics and substrates with reduced sensitivity to mechanical mounts.

Surface figure control for coated optics

An improved light weight, stiff stage platen for photolithography is provided. The high stiffness of the stage platen is exemplified by a relatively high first resonant vibrational mode as determined, for instance, by finite element modal analysis. The stage platen can be employed to support a chuck that is designed to secure a mask or wafer. The stage platen includes a frame that has interior walls that define an interior region and that has exterior walls wherein the outer surfaces of at least two adjacent walls are reflective mirror surfaces; and a matrix of ribs within the interior region that is connected to the interior walls wherein the stage platen exhibits a first vibrational mode at a frequency of greater than about 1000 Hz.

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Pleasanton, CA, United States of America

Paul Andrew Spence