Cadence Design Systems, Inc.

Patrick Gallagher

Vivek Chickermane

Steven Lee Gregor

Brian Edward Foutz

Sandeep Bhatia

Ankur Gupta

Krishna Chakravadhanula

Manish Pandey

Pinhong Chen

Qi Wang

Huan-Chih Tsai

Christina Chu

Steven Sharp

Yonghao Chen

Nitin Parimi

Puneet Kumar Arora

Joseph Michael Swenton

Norman Robert Card

Sameer Chakravarthy Chillarige

Thomas Webster Bartenstein

Mitchell W Hines

Rajesh Khurana

Sharjinder Singh

Sonam Kathpalia

Robert Jordan Asher

Carl Alexander Wisnesky, Ii

Carl Barnhart

James Sage

Xiaochuan Yuan

Yonghoa Chen

Systems and methods disclosed herein provide for efficiently testing memories during mission mode self-test ('MMST') without destroying any original functional data. Embodiments provide for a converter to feed a manipulated version of the original functional data back into the tested memories. Embodiments further provide an accumulator to count the occurrences of correctable and uncorrectable errors associated with the tested memories.

Testing for memories during mission mode self-test

Systems and methods disclosed herein provide for improved testing of memory error correction code ('ECC') logic with memory built-in self-test ('MBIST'). Embodiments provide for a masking element to inject one or more faults into the ECC logic during at least one of a manufacturing test ('MFGT') and a power-on-self-test (&#x201c;POST&#x201d;), wherein, based on the injected faults, it can be determined if the ECC logic contains any errors.

Testing for memory error correction code logic

Systems and methods disclosed herein provide for an integrated circuit partitioned into a plurality of regions of a two-dimensional grid, wherein each region of the grid corresponds to similarly located scan flops. The systems and methods also provide for enabling clock gates to scan flops in some regions of the integrated circuit and disabling clock gates to other regions in order to better manage power dissipation during ATPG. Specifically, toggle disabling templates are applied during ATPG in order to enable clock gates in certain regions of the two-dimensional grid.

2D compression-based low power ATPG

Embodiments relate generally to a scalable, modularized mechanism which allows for storing programmable data streams on chip and provides repeatable on-demand issuances of data streams to one or more targeted instruments. In some embodiments, multiple data streams are grouped into data stream schedules to perform a series of programmable operations on demand. In these and other embodiments, data stream schedules can be reused and further grouped into data stream plans that can be executed in any order upon request or are hard-coded in a specific order.

On demand data stream controller for programming and executing operations in an integrated circuit

Systems and methods disclosed herein provide for automatically diagnosing mis-compares detected during simulation of Automatic Test Pattern Generation ('ATPG') generated test patterns. Embodiments of the systems and methods provide for determining the origin of a mis-compare based on an analysis of the generated test patterns with a structural simulator and a behavioral simulator.

Method and apparatus for automatic diagnosis of mis-compares

A method and apparatus for hierarchical compaction of test patterns to be applied to an integrated circuit during test is disclosed. The embodiments apply a hierarchical strategy for categorizing test patterns for compaction. A test pattern is considered against a series of criteria for a compacted test pattern. Where all the criteria are met the test pattern is merged into a compacted test pattern. If the criteria are not all met the test patterns are considered against each of the compacted test patterns in turn. This is repeated for each test pattern to create a set of compacted test patterns conforming to the requirements of the criteria. This method and apparatus provides for fine grained control of low power constraints when testing integrated circuits, and includes benefits such as preventing damage during test from burnout and hot spots, and avoiding failures due to IR drop.

Hierarchical compaction for test pattern power generation

A method of adding power control circuitry to a circuit design at each of an RTL and a netlist level comprising: demarcating multiple power domains within the circuit design; specifying multiple power modes each power mode corresponding to a different combination of on/off states of the multiple demarcated power domains; and defining isolation behavior relative to respective power domains.

Method and mechanism for implementing electronic designs having power information specifications background

A method for implementing a single file format for power-related information for an IC comprising: providing a circuit design in at least one design file in a non-transitory computer readable storage device; providing power-related design information in a file in the computer readable storage device that is separate from the at least one design file and that specifies multiple power domains within the circuit design, each power domain including one or more design object instances from within the circuit design and that specifies multiple power modes each power mode corresponding to a different combination of on/off states of the multiple specified power domains and that specifies isolation behavior relative to respective power domains; and using a computer to add power control circuitry to the circuit design that implements the power domains and power modes and isolation behavior specified in the power specification information.

A method and system for identifying power defects using test pattern switching activity is disclosed. In one embodiment, a plurality of test patterns is applied to a circuit under test, and failure test patterns are identified from the plurality of test patterns by comparing the test result with the predicted test result. A switching activity count is obtained for each of the plurality of test patterns. Based on the switching activity count, ranks for each of the plurality of test patterns are provided. A correlation analysis is performed between the failure test patterns and the ranks of the switching activities. When there is a high correlation between the failure test pattern and the ranks of the switching activities, it is determined that the circuit likely contains a power defect. A power defect analysis is performed under the presence of the high correlation.

Method and system for identifying power defects using test pattern switching activity

A method of testing an Integrated Circuit (IC) includes: loading a sequence of data into a chain of circuit elements that hold data values, where outputs of at least some circuit elements are connected to inputs of adjacent circuit elements so values move sequentially through the chain between a chain input for loading values and a chain output for unloading values, and a first circuit element includes a retention element for saving values during power variations related to the IC. The method further includes: saving a value from the data sequence in the retention element; and accessing the retention element for verifying an accuracy of the saved value from the data sequence.

Testing state retention logic in low power systems

In a circuit adapted for scan testing, a first set of connections configures the circuit elements into power domains with separate power-level controls, and a second set of connections configures the circuit elements to form scan segments for loading values into circuit elements from input ends of the scan segments and unloading values from circuit elements at output ends of the scan segments. A decompressor circuit receives a decompressor input and is operatively connected to the scan-segment input ends, and a compressor circuit is operatively connected to the scan segment output ends and generates a compressor output. Isolation circuits at scan-segment exits set values for scan segments at scan-segment exits when a corresponding independent power domain is in a power-off state.

Scan testing architectures for power-shutoff aware systems

A method for testing integrated circuits is provided. The method provides for incorporating compression and decompression logic into each sub-component of an integrated circuit, developing test modes that target different sub-components of the integrated circuit, selecting one of the test modes, applying a test pattern to one or more sub-components of the integrated circuit targeted by the one test mode, comparing a response from application of the test pattern to a known good response, and diagnosing the response to determine which part of the one or more sub-components targeted by the one test mode failed when the response does not match the known good response.

Distributed test compression for integrated circuits

A method is provided to improve the usability of Design-For-Testability Synthesis (DFTS) tools and to increase the design process productivity. The method comprises receiving a list of testability and design impact analysis functions, to be performed on the circuit, also referred to as a device under test (DUT). The impact analysis leads to the creation of logical transformations, which can be selected by a user with one or more available transformation methods from a list including, but not limited to, boundary scan test logic insertion, scan test logic insertion, memory BIST (built-in-self-test) logic insertion, and logic BIST logic insertion, and scan test data compression insertion logic insertion.

Design-For-testability planner

In the field of integrated circuit design and testing, especially directed towards integrated circuits intended to operate at low power, a method and system are provided for circuit design and simulation and testing for mapping portions of a circuit, such as a power domain or portion of a power domain, to a test mode. Thereby only those portions of the circuit which need to be powered up in a particular test mode are powered up both in the design (simulation) phase and in the actual testing. This conserves power usage during actual testing as against powering up all portions of the circuit, which is not desirable during the testing of the circuit after manufacture. This ensures that the power conditions required to excite and observe any circuit faults during testing exist for the power conditions that are applied during, for instance, manufacturing testing. By automatically partitioning the faults to remove those that cannot be excited or observed during manufacturing and testing, the testability of the device in terms of its partitions or parts will accurately reflect the power state of the logic portions of the circuit.

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Apalachin, NY, United States of America

Patrick Gallagher