Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Patricia Connell

Yuhua Tong

Lee Melbourne Cook

Jeffrey James Hendron

Joseph K So

The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.

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Rising Sun, MD, United States of America

Patricia Connell