Phicom Corporation

Other

Olewolff Uniwell Acoustics Co., Ltd.

Philcom Corporation

Oug-Ki Lee

Jung-Hoon Lee

Joo-Bae Kim

Seong-Hoon Jeong

Seong Hoon Jeong

Jung Hoon Lee

Kyu-Hyun Shin

Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.

Probe and method of making same

Provided is a probe card and method of fabricating the same. This method comprises forming soldering bumpers electrically connected to conductive patterns on a substrate, forming probes connected to the conductive patterns and supported by the soldering bumpers, and then melting the soldering bumpers to fixing the probes to the substrate. Forming the soldering bumpers includes a step of forming the soldering bumpers in the same pattern and size by means of a photolithography process.

Method of fabricating a probe card

Disclosed is a vertical probe and methods of fabricating and bonding the same. The probe is comprised of a contactor equipped with two tips, a connector electrically linking with a measuring terminal of a measurement system, And a bump connecting the contactor to the connector and buffing physical stress to the contactor.

Vertical probe and methods of fabricating and bonding the same

Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for semiconductor integrated circuit testing equipment is manufactured, and a probe bonding method using the same. The probe positioning and bonding device comprises a stage unit disposed on a working table, a microscope disposed above the stage unit while being supported by means of a first supporting member disposed on the working table, a probe fixing unit disposed above the stage unit and below the microscope while being supported by means of a second supporting member disposed on the working table, and a light source unit supported by means of a third supporting member disposed on the working table. The light source unit is disposed toward the upper part of the stage unit.

Probe positioning and bonding device and probe bonding method

Disclosed is an electrical contact element used to test an electronic device. The electrical contact element has a beam portion and a tip portion attached to an end of the beam portion. In representative embodiments, a part of the beam portion is bent, e.g., such that the beam portion is zigzagged one or more times. A projection may be formed around a proximal end of the tip portion.

Method for manufacturing electrical contact element for testing electronic device and electrical contact element manufactured thereby

The present invention relates to a contact tip structure of a connecting element designed for electric testing of electronic components. The connecting element comprises a fixing post coupled to a first electronic component; a beam extending away from said fixing post; a base coupled at one end of the said beam; and a contact tip extending vertically from the bottom surface of the said base. The beam includes an elastic region and an inelastic region extending at a shorter distance than the elastic region. The base vertically extends from the inelastic region in a certain distance and the horizontally extended length (L) of the elastic region of the beam and the vertically extended length (D) of the base are determined such that the contact tip is horizontally extended at a pre-determined distance according to the following formula:Dsin &#x3b8;+L(cos &#x3b8;&#x2212;1)(&#x3b8; means an angle of elastic deformation of the beam).

Contact tip structure of a connecting element

In a bone conduction speaker, a body has a shape of a cylinder, and a vibrating plate is inserted to a mastoid to close an upper opening portion of the body. An auxiliary vibrating plate is inserted to the mastoid under the vibrating plate. A vibrating coil is attached on a lower side of the auxiliary vibrating plate. A speaker plate is fixed at an inner central portion of the body, and a ring type magnet is fixed on the speaker plate. An edge portion of a yoke is fixed on the ring type magnet and a central portion of the yoke has a protrusion which protrudes in the inside direction of a central hole of the speaker plate. An acoustic vibrating plate is fixed at a lower portion of the body, and an acoustic coil is fixed on the acoustic vibrating plate.

Bone vibrating speaker using the diaphragm and mobile phone thereby

The present invention relates to a subminiature bone conduction speaker by using a vibrating plate and a mobile phone having the subminiature bone conduction speaker. A subminiature bone conduction speaker using a vibrating plate according to the present invention comprises a body having a shape of a cylinder of which upper portion is opened; yoke which is disposed in a lower portion of the body and of which center has a protrusion; a ring type magnet which is formed on the edge of the yoke and apart from an end portion of the protrusion by a predetermined clearance; an upper plate which is formed on the magnet; a mastoid which is contacted to bone conduction of a user and by which vibration is transmitted to the user; an acoustic vibrating plate which is inserted at a lower side of the mastoid to cover the opening portion of the body and which is made of an elastic material; an auxiliary vibrating plate which is inserted under the acoustic vibrating plate which is inserted to the mastoid; a voice coil which is attached to the auxiliary vibrating plate and which is inserted between the end portion of the protrusion of the yoke and the ring type magnet; a front cap for fixing the acoustic vibrating plate on the body; and a electrical signal input unit for inputting an electric signal to the voice coil.

Subminiature bone vibrating speaker using the diaphragm and mobile phone thereby

The present invention relates to a hollow microprobe using an MEMS technique and a method of manufacturing the same. A method of manufacturing a hollow microprobe using an MEMS technique according to the present invention comprises: a step of forming a protection film pattern on a substrate; a step of forming a through hole on the substrate using the protection film pattern as a mask; a step of forming a seed layer on the upper portion of the protection film pattern of the substrate provided with the through hole and an inside wall of the through hole; a step of removing the seed layer of the upper portion of the substrate and the protection film to remain the seed layer only in the inside surface of the though hole, a step of forming a buried conductor within the through of the substrate by an electroplating method; a step of planarizing the top surface of the substrate provided with the buried conductor; a step of forming a base conductive film on the substrate which its top surface is planarized; a step of forming a first tip supporter on the substrate provided with the base conductive film and having a oblique surface sloping down; a step of rounding the top surface of the first tip supporter; a step of forming a second tip supporter; a step of forming a second tip supporter on the outside surface of the first tip supporter to open the top surface of the first tip supporter; a step of forming a conductive material tip on the outside surface of the second tip supporter; and a step of removing the top surface of the opened first tip supporter with a predetermined depth.

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Seoul, South Korea

Oug-Ki Lee