Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Osamu Sasaki

Satoshi Saito

Naoko Kihara

Tsukasa Tada

Takuya Naito

Fumihiko Yuasa

Tohru Ushirogouchi

Toru Ushirogouchi

Hideo Ohta

Akira Yoshizumi

Hirokazu Niki

Masami Enda

Hideo Honma

Seizaburo Shimizu

Hitoshi Sakai

Kunihiro Ikari

Tsutomu Takamura

Kazuhiro Takeda

Jiro Sakurai

Toshiki Sasabe

Takashi Jonai

Photosensitive composition containing a dissolution inhibitor and an acid releasing compound

A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms &mdash;COO,or &mdash;SO,; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150&deg; C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern.

Photosensitive composition and method of forming a pattern using the same

An insulating shield plate (1) divides a room of an electrolysis bath (2) into an anode chamber (13) and a cathode chamber (14). An anode (5) is disposed in the anode chamber (13), and a cathode (6), metallic waste (7) and heater (4) are disposed in the cathode chamber (14). An electrolyte (3) stored in the electrolysis bath (2) flows in a circulation path from a circulating pump (10) through a circulating line (12) and filter (11) to return the electrolysis bath (2). An exhaust gas processing device 9 is connected to the electrolysis bath (2). When a voltage is supplied to the anode (5) and cathode (6), a surface of the metallic waste (7) is charged in a positive polarity to dissolve a base metal of the metallic waste (7). Further, a cylindrical anode (33) is arranged in an electrolyte (32) in an electrolysis bath (31), and a cylindrical metal (34) as a metallic waste is arranged in the cylindrical anode (33). After a bar-shaped cathode (35) is arranged in the cylindrical metal (34), a DC voltage is supplied to the cylindrical anode (33) and the bar-shaped cathode (35). At this time, the system may be constructed in that oxygen occurs by charging in a positive polarity in an inner surface of the cylindrical metal (34) and the base metal of the cylindrical shape is dissolved.

Apparatus for electrochemical decontamination of radioactive metallic

On a substrate a protective layer is formed which can suppress the diffusion of a contaminant from the substrate. On the protective layer, thus formed, a resin layer is formed. The resin layer comprises a photosensitive composition containing a compound which has a substituent group capable of being decomposed or cross-linked in the presence of an acid, and a compound which can generate an acid when exposed to light. The resin layer is pattern-exposed to light and then baked at a predetermined temperature. The resin layer is developed, whereby the exposed portions of the resin layer are removed or left, thus forming a pattern comprising lines and spaces each having a predetermined width. Each of the lines of the pattern has a cross-section having neither sloped profile nor undercut profile, and the pattern therefore has an improved resolution.

Pattern forming method

A photosensitive composition comprises an alkali-soluble resin, a compound which has a substituent group decomposable by an acid and generates an alkali-soluble group upon decomposition of the substituent group, or a compound which has a substituent group capable of crosslinking the alkali-soluble resin in the presence of an acid, and a compound which generates an acid upon exposure, which is represented by formula (1) given below: ##STR1## wherein R.sub.11 represents a monovalent organic group or a monovalent organic group into which at least one selected from the group consisting of a halogen atom, a nitro group, and a cyano group is introduced, each of R.sub.12, R.sub.13, and R.sub.14 independently represents hydrogen, a halogen atom, a nitro group, a cyano group, a monovalent organic group, or a monovalent organic group into which at least one selected from the group consisting of a halogen atom, a nitro group, and a cyano group is introduced.

Photosensitive composition comprising alkali soluble binder and

A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms --COO.sup.- or --SO.sub.3.sup.- ; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150.degree. C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern. ##STR1## where R.sub.1 and R.sub.2 are either the same or different, each of which represents at least one selected from the group consisting of hydrogen, halogen atom, cyano group, nitro group, silyl group, and monovalent organic group; X represents &gt;C.dbd.O or --SO.sub.2 --; Y represents a divalent organic group; R.sub.1 and R.sub.2 can be bonded together, forming a ring; and at least one of R.sub.1, R.sub.2, and Y has a substituent which is decomposed by an acid.

Potosensitive composition and method of forming a pattern using the same

There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns are transferred onto a thermoplastic resin, without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns of the original plate against a thermoplastic resin with the copper foil interposed therebetween to transfer portions of the copper foil in contact with the protruding patterns onto the surface of the thermoplastic resin, thereby forming the circuit patterns.

Method for manufacturing printed circuit board

There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: ##STR1## Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-soluble cyanides.

Chemical copper-plating bath

Growing community of inventors

Sagamihara, Japan

Osamu Sasaki