Average Co-Inventor Count = 2.26
ph-index = 10
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Kabushiki Kaisha Shinkawa (14 from 349 patents)
2. Kabushiki Kaisha Toshiba (4 from 52,751 patents)
3. Dai Nippon Printing Co., Ltd. (4 from 3,202 patents)
4. Fuji Xerox Co., Ltd. (3 from 11,665 patents)
5. Tsukamoto Seiki Co., Ltd. (3 from 5 patents)
6. Minebea Company, Limited (2 from 1,160 patents)
7. Nippon Chemi-Con Corporation (2 from 170 patents)
8. Renesas Electronics Corporation (1 from 7,529 patents)
9. Toa Nenryo Kogyo Kabushiki Kaisha (1 from 220 patents)
10. Toa Nenryo Kogyo, K. K. (1 from 39 patents)
11. Secom Co., Ltd. (1 from 16 patents)
12. Japan National Oil Corporation (1 from 16 patents)
13. Sony Corporation (58,131 patents)
37 patents:
1. 10096135 - Image processing LSI and image processing program
2. 9627145 - Electrolytic capacitor for use in a charge/discharge circuit with shorter period and greater voltage difference
3. 8896164 - Permanent-magnet stepping motor
4. 8274780 - Polarizable electrode for electric double layer capacitor and electric double layer capacitor using the same
5. 7627765 - Document management apparatus and document management method, and storage medium storing program
6. 6637528 - Bit apparatus
7. 6502757 - Information recorded medium, device for reading the information, information recorded medium transfer foil, and method for producing information recorded medium
8. 6447355 - Impregnated-type cathode substrate with large particle diameter low porosity region and small particle diameter high porosity region
9. 6304024 - Impregnated-type cathode substrate with large particle diameter low porosity region and small particle diameter high porosity region
10. 6244493 - Die bonding apparatus
11. 6034469 - Impregnated type cathode assembly, cathode substrate for use in the
12. 5897049 - Method for wire-bonding a covered wire
13. 5891796 - Method for wire-bonding a covered wire
14. 5853532 - Wafer ring supply and return device
15. 5823418 - Die transporting device