Tokyo Electron Limited

Osamu Kuroda

Takehiko Orii

Tatsuya Nishida

Hidemasa Aratake

Yuji Kamikawa

Kouzou Kanagawa

Issei Ueda

Masahiro Yoshida

Tsuyoshi Nomura

Kenji Soejima

Satoshi Kaneko

Takayuki Toshima

Norihiro Ito

Hideaki Sato

Koji Tanaka

Shigenori Kitahara

Satoshi Morita

Hiroki Taniyama

Junya Minamida

Takashi Nagai

Kazuyoshi Eshima

Kotaro Tsurusaki

Takafumi Tsuchiya

Akira Murata

Yasuhiro Chouno

Takahiro Kawazu

Kouji Ogura

Teruaki Konishi

Kouji Kimoto

Akira Koguchi

Kazuyuki Honda

Katuki Yamasaki

Jiro Harada

Hiroshi Yamahata

Masayuki Yokomori

Takayuki Ogami

A substrate processing apparatus includes a processing tub, a storage, a liquid recovery unit, a storage drain line and a liquid recovery unit drain line. The processing tub is allowed to accommodate therein multiple substrates, and configured to store therein a processing liquid. The storage is connected to the processing tub, and configured to store therein the processing liquid drained from the processing tub. The liquid recovery unit is configured to receive the processing liquid overflown from the processing tub. The storage drain line is configured to drain a liquid stored in the storage. The liquid recovery unit drain line is configured to drain a liquid received from the liquid recovery unit to an external drain line provided at an outside.

Substrate processing apparatus and apparatus cleaning method

A substrate liquid processing apparatus includes a processing liquid storage unit configured to store a processing liquid therein; a processing liquid drain unit configured to drain the processing liquid from the processing liquid storage unit; and a control unit. The control unit performs a first control in a constant concentration mode in which a concentration of the processing liquid in the processing liquid storage unit is regulated to a predetermined set concentration and a second control in a concentration changing mode in which the concentration of the processing liquid is changed. In the second control, a set concentration after concentration change is compared with a set concentration before the concentration change, and when the set concentration after the concentration change is lower, the control unit controls the processing liquid drain unit to start draining of the processing liquid.

Substrate liquid processing apparatus

A substrate processing apparatus includes a processing tub, a liquid recovery unit, a liquid recovery unit drain line, a storage, a first and a second liquid supply lines, a discharge line, a first and a second liquid flow rate controllers. The liquid recovery unit receives a processing liquid overflown from the processing tub. The liquid recovery unit drain line drains the processing liquid from the liquid recovery unit. The first and the second liquid supply lines supply a first and a second liquids, respectively. The cleaning liquid contains the first liquid and the second liquid, and removes a precipitate from the processing liquid. The discharge line discharges the cleaning liquid, the first liquid or the second liquid toward the liquid recovery unit. The first and the second liquid flow rate controllers are provided at the first and the second liquid supply lines, and adjust flow rates thereof, respectively.

There is provided a substrate processing apparatus including: a processing part configured to process a substrate with a processing liquid; and a processing liquid generation part configured to generate the processing liquid supplied to the processing part. The processing liquid generation part includes: a reservoir configured to store the processing liquid; a circulation line through which the processing liquid stored in the reservoir is circulated; a heater configured to heat the processing liquid; and a nozzle provided at a downstream side of the circulation line and has at least one ejection port formed to eject the processing liquid heated by the heater from above a liquid level of the processing liquid stored in the reservoir.

Substrate processing apparatus and processing liquid concentration method

Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Substrate processing apparatus

A substrate processing apparatus includes a substrate transit table configured to mount thereon a plurality of substrates; a substrate processing chamber configured to process the substrate one by one; a substrate transfer device capable of loading the substrate into the substrate processing chamber from the substrate transit table and unloading the substrate from the substrate processing chamber to the substrate transit table; and N number of (N is an integer equal to or larger than 3) substrate holding devices provided at the substrate transfer device and configured to hold the substrates one by one. Here, a multiplicity of (2 to N&#x2212;1 number of) substrates are concurrently held by 2 to N&#x2212;1 number of substrate holding devices among the N number of substrate holding devices and one substrate is loaded into the substrate processing chamber.

Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program

An apparatus for accurately determining if a substrate is properly retained by a substrate-retaining mechanism. The apparatus includes a substrate-retaining mechanism to retain a wafer, a treatment liquid supply mechanism to supply a treatment liquid to the wafer, and a rotatable cup adapted to rotate as an integral unit with the substrate-retaining mechanism while covering the outer peripheral portion of the wafer. The substrate-retaining mechanism has a retaining member with two ends. If the first end retains a wafer, the second end is in an upper position. If the first end retains no wafer, the second end is in a lower position. A touch sensor is arranged below the second end of the retaining member so that, when the second end is in the lower position, the second end makes contact with the touch sensor.

Treatment apparatus, treatment method and storage medium

A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliersfor supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliersalong the peripheral part of the wafer W relatively. The fluid suppliersare arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.

A liquid processing apparatus comprises a liquid processing section for applying a liquid processing to wafers W, a carrier delivery section for delivering the carrier housing the wafers W, a carrier stock section capable of storing a plurality of carriers, an interface section for transferring the wafers W between the carrier stock section and the liquid processing section, a carrier transfer device for transferring the carrier, a wafer inspecting device for inspecting the wafers W within the carrier, and a carrier transfer device control section for controlling the carrier transfer device. The carrier transfer device control section controls the carrier transfer device such that the carrier, which has been judged to be capable of a liquid processing on the basis of the result of the inspection of the wafers W, is stored in the carrier stock section, and the liquid processing is started after completion of the inspection of a predetermined number of carriers.

Liquid processing apparatus and liquid processing method

The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.

A substrate processing apparatus for processing a substrate With a processing fluid is provided. The apparatus includes holding membersfor holding the substrate W, a chuck memberfor supporting the holding membersand a top-face memberapproaching the substrate W to cover its surface. In arrangement, since the top-face memberis supported by the chuck member, the holding members 60 can rotate together with the top-face memberin one body. With this structure, it is possible to reduce the influence of particles on the substrate W and also possible to provided a low-cost substrate processing apparatus occupied as little installation space as possible.

Processing apparatus and substrate processing method

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Tosu, Japan

Osamu Kuroda