Essai, Inc.

Oksana Kryachek

Nasser Barabi

Chee Wah Ho

Joven R Tienzo

Elena V Nazarov

Chee-Wah Ho

Hin Lum Lee

Ho Chee-Wah

An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

Probe system for QFP integrated circuit device test tooling

A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to 'swipe' the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.

Contactor with angled depressible probes in shifted bores

A test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact, for example, reliable grounding, with a corresponding plurality of DUT contacts when under a compliant force. Reliability and/or grounding can be accomplished by introducing a small angular differential between the bore axis of the upper block and the bore axis of the main block.

Integrated circuit device test tooling with dual angle cavities

The present invention relates to systems and methods for preventing over pressurization in a fluid management system used in an integrated circuit (IC) device tester. The prevention of the over pressurization in the fluid management system is based on the use of a pressure relief valve coupled to the fluid management system.

Systems and methods for conforming device testers to integrated circuit device with pressure relief valve

A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to 'swipe' the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force.

Contactor with angled depressible probes

A thermal control unit used to maintain a set point temperature on an integrated circuit device under test, has at least one cooling plate configured to facilitate the testing of integrated circuits where the device under test requires efficient cooling.

Systems and methods for conforming test tooling to integrated circuit device with whirlwind cold plate

A laminated heater socket useful in association with an integrated circuit (IC) device tester is having a socket with an embedded integrated heater. This laminated heater socket configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits.

Systems and methods for conforming test tooling to integrated circuit device with heater socket

Contactor with angled spring probes

A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT.

Systems and methods for conforming test tooling to integrated circuit device profiles with convex support structure

A test pusher assembly, useful in association with a thermal control unit used to maintain a set point temperature on an integrated circuit device under test, is provided with ejection mechanisms configured to facilitate the disengagement of the DUT at the end of the test. One example of the ejection mechanisms is to provide the substrate pusher assembly with spring-loaded pins that can push the substrate of the DUT away from the pedestal at the end of the test. Another example of the ejection mechanisms is to use a pressurized fluid that can push the substrate of the DUT away from the pedestal at the end of the test.

Systems and methods for conforming test tooling to integrated circuit device profiles with ejection mechanisms

A test socket assembly, useful in association with a thermal control unit (TCU) used to maintain a set point temperature on an IC device under test, has alignment holes with bushings that are secured within the alignment holes by using retaining pins. The retaining pins can be easily screwed in and out of the socket. This provision allows the bushings to be replaced easily as they get worn out or deformed from repeated testing.

Systems and methods for conforming test tooling to integrated circuit device profiles with sockets having secured and replaceable bushings

A test socket assembly, useful in association with a thermal control unit used to maintain a set point temperature on an IC device under test, has at least one compliant pedestal is configured to facilitate the testing of integrated circuits where the device under test comprises a substrate having multiple IC chips with different heights and testing requirements.

Systems and methods for conforming test tooling to integrated circuit device profiles with compliant pedestals

An integrated circuit (IC) device tester maintains a set point temperature on an IC device under test (DUT) having a die attached to a substrate. The tester includes a thermal control unit and a fluid management system configured to supply the thermal control unit with fluids for pneumatic actuation, cooling, and condensation abating. The tester can includes a box enclosing the thermal control unit thereby providing a substantially isolated dry environment during low humidity testing of the DUT. The heat exchange plate may include an inner structure for thermal conductivity enhancement.

Systems and methods for conforming device testers to integrated circuit device profiles with feedback temperature control

A device tester for an IC device under test (DUT), the DUT having a substrate and an attached die. The device tester includes a thermal control unit and a test socket assembly which conforms to the DUT's profile. The thermal control unit includes a pedestal assembly, a heater having a fuse coupled to a heating element, a substrate pusher, and a force distributor for distributing force between the pedestal assembly and the substrate pusher. The test socket assembly includes a socket insert that supports and also conforms to the DUT's profile.

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San Francisco, CA, United States of America

Oksana Kryachek