Applied Materials, Inc.

Applied Materials Israel Limited

Ofer Bokobza

Ariel Ben-Porath

Youval Nehmadi

Vicky Svidenko

Jacob Joseph Orbon, Jr

Erez Ravid

Gilad Almogy

Rinat Shimshi

Josephine Phua

Evgeny Levin

Jacob J Orbon, Jr

Rinat Shishi

Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.

Design-based method for grouping systematic defects in lithography pattern writing system

Grouping systematic defects with feedback from electrical inspection

A method for monitoring fabrication of an integrated circuit (IC) on a semiconductor wafer includes generating a product design profile (PDP) using an electronic design automation (EDA) tool, the PDP comprising an indication of a site in at least one layer of the IC that is susceptible to a process fault. Upon fabricating at least one layer of the IC on the wafer, a process monitoring tool is applied to perform a measurement at the site in at least one layer responsively to the PDP.

Design-based monitoring

Growing community of inventors

Cupertino, CA, United States of America

Ofer Bokobza