Tokyo Electron Limited

Nozomu Nagashima

Naohiko Okunishi

Tomoyuki Takahashi

Hiroki Endo

Dai Kitagawa

Suguru Sato

Eiichiro Kikuchi

Koei Ito

Ryuichi Yui

Taisei Seguchi

There is a substrate processing apparatus comprising: a chamber including a sidewall having an opening; a substrate support disposed in the chamber; a support member disposed above the substrate support; an inner wall member having a ceiling portion disposed above the substrate support and below the support member; a contact member attached to one of the support member and the inner wall member and configured to detachably fix the inner wall member to the support member by applying a spring reaction force to the other of the support member and the inner wall member in a horizontal direction; and an actuator configured to move the inner wall member downward to release the fixing of the inner wall member to the support member.

Substrate processing apparatus and maintenance method for substrate processing apparatus

Provided is a filter device includes: a first coil group including a plurality of coils arranged along a central axis and spirally wound with a first inner diameter; and a second coil group including a plurality of coils arranged along the central axis and spirally wound with a second inner diameter larger than the first inner diameter. A pitch between respective turns of the plurality of coils of the second coil group is larger than a pitch between respective turns of the plurality of coils of the first coil group.

Filter device and plasma processing apparatus

A plasma processing apparatus includes a stage for supporting a target object in a chamber defined by a chamber body. The stage includes a lower electrode, an electrostatic chuck provided on the lower electrode, heaters provided in the electrostatic chuck, and terminals electrically connected to the heaters. A conductor pipe electrically connects a high frequency power supply and the lower electrode and extends from the lower electrode to the outside of the chamber body. Power supply lines supply power from a heater controller to the heaters. Filters partially forming the power supply lines prevent the inflow of high frequency power from the heaters to the heater controller. The power supply lines include wirings which respectively connect the terminals and the filters and extend to the outside of the chamber body through an inner bore of the conductor pipe.

Plasma processing apparatus

Provided is a filter device including a plurality of coils, a plural of capacitors, and a frame. The coils constitute a plurality of coil groups. Each coil group includes two or more coils. The two or more coils in each coil group are provided such that respective windings of the two or more coils extend spirally about a central axis and respective turns of the two or more coils are sequentially and repeatedly arranged in an axial direction in which the central axis extends. The coil groups are provided coaxially with the central axis. A pitch between the respective turns of the two or more coils of any one coil group among the coil groups is larger than a pitch between the respective turns of the two or more coils of the coil group provided inside the one coil group among the coil groups.

An adjustment method for filter units in a plasma processing apparatus includes a first measurement process of measuring a frequency characteristic of a reference filter unit selected among the filter units, and an adjustment process of adjusting a frequency characteristic of each of remaining filter units selected among the filter units excluding the reference filter unit. Further, the adjustment process includes an attachment process of attaching a capacitive member for adjusting a capacitance between wirings in each of the remaining filter units, a second measurement process of measuring a frequency characteristic of each of the remaining filter units to which the capacitive member is attached, and an individual adjustment process of adjusting a capacitance of the capacitive member such that the frequency characteristic of each of the remaining filter unit to which the capacitive member is attached becomes close to the frequency characteristic of the reference filter unit.

Adjustment method for filter unit and plasma processing apparatus

A filter device includes a plurality of coils of which central axes are spaced apart from one another and in parallel to one another and a plurality of ground members spaced apart from one another and extending in parallel to the central axes of the coils outside of the coils. Each of the coils is spaced apart from another coil closest thereto by a first distance. Each of the ground members is spaced apart from a coil closest thereto by a second distance. The number of ground members spaced apart from each of the coils by the second distance is the same.

A method is provided to design a filter. In the method, a difference between a high frequency to be blocked and a resonance frequency of a distributed constant type reference filter is obtained, the reference filter including a reference coil having windings wound at a plurality of pitches having the same length in an axial direction and a capacitor connected in parallel to the reference coil. When the difference is greater than the predetermined value, a split position in the reference coil where the reference coil is divided into a first coil element and a second coil element connected in series and a split distance between the first coil element and the second coil element to reduce the first difference.

Method for designing filter

A resonance frequency can be adjusted by shifting the resonance frequency without reducing an impedance function or a withstanding voltage characteristic against a high frequency noise, when blocking, by using a multiple parallel resonance characteristic of a distributed constant line, the high frequency noise introduced into a power feed line from an electrical member other than a high frequency electrode within a processing vessel. Comb teeth M of a comb-teeth memberare inserted into winding gaps of air core coils() and(). For example, first comb teeth M&#x2212; having a thickness m&#x2212; smaller than a standard thickness ts are mainly inserted in an effective zone A in a central portion of the air core coils. Further, in non-effective zones B at both sides or both end portions thereof, second comb teeth M+ having a thickness m+ equal to or larger than the standard thickness ts are arranged.

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Miyagi, Japan

Nozomu Nagashima