Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Tokyo Electron Saga Limited

Tel Kyushu Limited

Noriyuki Anai

Tsutae Omori

Takami Satoh

Kiyohisa Tateyama

Takayuki Tomoeda

Mitsuhiro Sakai

Kengo Mizosaki

Masami Akimoto

Hiroshi Tanaka

Osamu Hirakawa

Hideyuki Takamori

Koji Harada

Hirofumi Shiraishi

Shinya Murakami

Sinichiro Izumi

Yoshio Kimura

Kimio Motoda

Masafumi Nomura

Yuuji Kamikawa

Masaaki Takizawa

Tatsuya Iwasaki

Mitsuru Ushijima

Yasuhiro Sakamoto

Shinichiro Araki

Shinzi Kitamura

Yoichi Honda

Kouji Harada

Shinobu Tanaka

Shinkou Matsumoto

Yuji Shimomura

Shinko Matsumoto

Kouichi Tanoue

Yuji Kamikawa

Yasushi Hayashida

Masanori Tateyama

Yoshitaka Matsuda

Masashi Moriyama

Keisuke Shigaki

A coating apparatus has a spin chuck for attracting and holding a semiconductor wafer in a horizontal state by means of vacuum. A movable beam is arranged above the spin chuck. The movable beam includes first and second nozzles integrally formed. The first nozzle is used for supplying a photo-resist liquid while the second nozzle is used for supplying a solvent for the photo-resist liquid. When a coating process is performed, the movable beam above the wafer is horizontally moved in one direction. The solvent is first supplied onto the wafer from the second nozzle, and the coating or photo-resist liquid is then supplied from the first nozzle, following the solvent. Wettability of the wafer relative to the photo-resist is increased by the solvent, prior to supply of the photo-resist liquid.

Coating method and apparatus for semiconductor process

A substrate is held on a spin chuck, and resist solution is supplied to the surface of the substrate at a plurality of positions spaced at predetermined intervals from a plurality of resist nozzles provided the bottom surface of a resist pipe provided over a first direction across the surface of the substrate. Thereafter, the substrate is oscillated or rotated, thereby making the resist solution on the substrate a thin coating film with a uniform thickness. In the coating apparatus and method, which are excellent in responsiveness to a degree of viscosity of coating solution, various kinds of treatment agents with a wide range of viscosity can be used, and mechanical accuracy such as the space between the nozzles and the substrate, accuracy of the nozzle size, and the like can be loosened.

Coating apparatus and coating method

A film forming apparatus comprising: a spin chuck; a cup; a lid; a first circular/tubular nozzle for supplying a resist solution to a first portion corresponding to the rotation center portion of a rectangular substrate; a plurality of second circular/tubular nozzles that supply the resist solution to a plurality of second portions of the rectangular substrate to which supply of the resist solution by centrifugal force is difficult, the distances between the rotation center portion and each of the second portions being greater than a half of a shorter side of the rectangular substrate; a rectangular nozzle holder that holds the first nozzle and the second nozzles; a mechanism that positions the nozzle holder; a controller that controls an amount of the resist solution from the first and second nozzles, attaches the lid to the cup, and rotates the substrate with the spin chuck; a resist solution tank; a supply tube provided between the resist solution tank and the first and second nozzles; a bellows pump for supplying the resist solution to the first and second nozzles; and an air operation valve for passing or stopping the resist solution in the supply tube.

Film forming apparatus

A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.

Substrate treating method

A coating and developing apparatus for coating a substrate with a plurality of color resists and for developing it after exposure, comprises: a scrubbing unit for scrubbing the substrate; a coating unit having a plurality of resist discharge nozzles for respectively discharging a plurality of color resists on the scrubbed substrate; and a developing unit for developing the substrate coated with the color resists after exposure. Accordingly, reduction in size of apparatus and space savings can be achieved, and manufacturing cost can also be reduced.

Coating and developing method

Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.

Substrate process method and substrate process apparatus

Coating and developing apparatus

A film-forming method comprises the steps of: (a) holding a rectangular substrate by a spin chuck provided in a cup; (b) positioning a solvent supply nozzle above the rectangular substrate and supplying a solvent to the rectangular substrate, the solvent supply nozzle having a liquid discharge port which has a length at least corresponding to that of a peripheral portion of the rectangular substrate; (c) positioning a process liquid supply nozzle above the rectangular substrate and supplying a process liquid to a portion at a rotation center portion of the rectangular substrate, thereby to form a film; (d) rotating the rectangular substrate in the cup to adjust a film thickness of the film; and (e) thereafter positioning the solvent supply nozzle above one peripheral portion of the rectangular substrate and supplying the solvent to the one peripheral portion of the rectangular substrate, whereby the film is removed from the one peripheral portion of the rectangular substrate, the substrate being subsequently rotated by the spin chuck to position the solvent supply nozzle to another peripheral portion of the rectangular substrate, whereby the film is removed from the another peripheral portion of the rectangular substrate.

Film forming method

Disclosed is an apparatus for removing a coated film from a peripheral portion of a substrate, comprising a section for holding a rectangular substrate horizontal, a surrounding member for surrounding a peripheral portion of the substrate held by the holding section, a discharge section mounted to face an upper peripheral portion of the substrate held by the holding section, rotatable about its longitudinal axis, a supply mechanism for supplying a solvent capable of dissolving the coated film into the solvent discharge section, a discharge rate controller for controlling the discharge rate of the solvent from the discharge section, a rotating mechanism for rotating the discharge section about its longitudinal axis between a first position in which the discharge port faces perpendicularly downward the front surface of the substrate and a second position, a suction mechanism, and control means for controlling the operation of each of the controller and the rotating mechanism.

Apparatus for removing coated film from peripheral portion of substrate

Apparatus for manufacturing a semiconductor for a liquid crystal display

Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

Washing apparatus, and washing method

Growing community of inventors

Kumamoto-ken, Japan

Noriyuki Anai