Tokyo Electron Limited

Norio Uchihira

Kiyohisa Tateyama

Mitsuhiro Sakai

Kiyomitsu Yamaguchi

Hiroshi Hashimoto

Fumio Satou

Yoshitaka Matsuda

Kimio Motoda

Tetsuya Sada

Masaaki Yoshida

Yoshiharu Ota

A cleaning unit for cleaning a substrate is disclosed, that comprises a holding mechanism for rotatably and horizontally holding the substrate, a first traveling means for holding both sides of a cleaning mechanism having at least one cleaning member and for moving the cleaning mechanism in such a manner that the first traveling means is kept in parallel with the substrate held by the holding mechanism, and a second traveling means for holding both sides of a processing solution supplying mechanism having supplying mechanisms for supplying different types of processing solution and for moving the cleaning mechanism in such a manner that the second traveling means is kept in parallel with the substrate held by the holding mechanism. Thus, the strength of the cleaning unit according to the present invention is higher than the strength of a conventional cleaning unit that holds an arm on one side thereof. In addition, a process of a cleaning mechanism and a process of a supplying mechanism can be equally performed on the entire surface of the substrate.

Substrate cleaning unit and cleaning method

A treatment device comprising a holding method for holding a substrate such as an LCD substrate; and a treatment solution supply method for supplying a treatment solution on a surface of the substrate wherein the holding method has a substrate-placing portion on which the substrate is disposed, the substrate-placing is made of a synthetic resinous material. Since the holding method has a substrate-placing portion which is made of a synthetic resinous material, the electric charge amount of the substrate can be reduced to prevent various static electricity caused troubles such as the electrostatic destruction of the device formed on the substrate. Further, a discharge noise trouble due to discharge phenomenon from the substrate to a transporting method can be prevented. Further, it is possible to reduce the electric charge amount of the holding method and destaticize the holding method by supplying a destaticizing fluid such as ionized pure water or ionized gas towards above or below the holding method. Thus, it is possible to prevent various static-electricity caused troubles such as the electrostatic destruction of the device formed in the device from occurring and further, possible to prevent noise troubles from occurring because the generation degree of the discharge which occurs between the substrate and the transport method can be reduced further. The electric charge amount of the substrate can be reduced by making the thickness (distance) of the substrate-placing portion formed of a dielectric thick (long).

Treatment device

A scrubbing apparatus comprises a holding member, which holds the outer circumference of the substrate from its back surface and has an opening to expose the back surface of the held substrate toward the bottom side; a supporting member, which supports substantially the center between two opposed sides of the holding member; a scrubbing brush, which comes in contact with the exposed back surface of the substrate from the bottom side; a brush drive mechanism, which transfers the scrubbing brush along the two opposed sides of the holding member; and a rotation drive mechanism, which drives to rotate the holding member together with the supporting member. Thus, a space can be saved, and the back surface of the substrate can be scrubbed.

Scrubbing apparatus and scrubbing method

Disclosed is a processing apparatus comprising holding means, support means, process solution supply means, life means, and rotating means. A substrate to be processed is rotatably held by the holding means. An overhanging portion of the substrate extending over an edge of the holding means is supported by the support means to maintain a front surface of the substrate horizontally flat. A process solution is supplied from the process solution supply means onto the front surface of the substrate held by the holding means and supported by the support means. The substrate held by the holding means is vertically moved by the lift means relative to the support means. Further, the substrate moved upward relative to the support means is rotated by the rotating means.

Apparatus and method for supplying process solution to surface of

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Kumamoto-ken, Japan

Norio Uchihira