Daikin Industries, Ltd.

Toho Kasei Ltd.

Other

Norio Maeda

Hiroshi Aihara

Masao Oono

Koji Sumi

Takazo Sotojima

Naoaki Izutani

Takao Matsumoto

Naoaki Izu Tani

A device for drying substrate comprising a processing vessel housing a specified number of substrates such as semiconductor wafers installed erectedly in parallel to one another, a first substrate supporting member supporting substrates within the processing vessel, the processing fluid supplying section supplying to the processing vessel, the processing fluid for performing processing such as cleaning processing on the substrates, a processing fluid exhausting section exhausting processing fluid from the processing vessel, and a drying fluid supplying section supplying, to the processing vessel, the liquid drops of drying fluid for performing drying processing on the substrates.

Method and device for drying substrate

A device for drying substrates which stores a plurality of substrate () and which comprises a processing container () to which cleaning fluid () after cleaning the substrates () is drained and an injection nozzle () for injecting drying fluid located at the terminating part of a feed pipe () through which liquid drying fluid is supplied, whereby an exhaust equipment is eliminated or simplified, and the drying fluid is fed smoothly.

The substrate drying apparatus has a substrate processing vessel, a substrate supporting section for supporting plural substratesin a standing condition and lined up condition in the interior of the substrate processing vessel, fluid reservoir sectionfor drying provided at an upward predetermined position of the substrate processing vessel, a first inert gas supplying sectionfor blowing inert gas against the drying fluidpooled in the fluid reservoir sectionfor drying so as to generate droplet of the drying fluid, and for guiding the droplet towards the center of the substrate processing vessel, and a second inert gas supplying sectionfor supplying inert gas vertically and downwardly so as to supply the generated droplet of the drying fluid towards the substrates, consequently safety is improved without providing special safety device, and sufficient amount of drying fluid is supplied to the dipping boundary face of the substrate and the cleaning liquid.

Method and apparatus for drying substrate

A device for processing a substrate comprises a processing vessel ( ), an outer vessel ( ) for surrounding the processing vessel ( ) which outer vessel ( ) can be sealed, a first supporting member ( ) for bringing the substrate ( ) into and out from the processing vessel ( ) which first supporting member ( ) supports the substrate ( ) in a standing manner, and a second supporting member ( ) for transferring the substrate ( ) between the first supporting member ( ) which second supporting member ( ) is movable up and down within the processing vessel ( ). The device processes the entire surface of the substrate ( ) uniformly and prevents varying in processing from occurrence.

Growing community of inventors

Yamatokouriyama, Japan

Norio Maeda