Tokyo Electron Limited

Norio Baba

Tatsuya Yamaguchi

Koji Yoshii

Hisashi Inoue

Hiroshi Kikuchi

Yasuaki Kikuchi

Masahiro Kobayashi

Mitsuru Obara

Keishi Shionaga

Wataru Nakajima

A heat treatment apparatus includes a heating unit provided around a processing container accommodating a substrate; a plurality of blowing units configured to blow a cooling medium into a space between the processing container and the heating unit; and a shutter configured to simultaneously opens/closes at least two of the plurality of blowing units and including a slit formed corresponding to each of the blowing units.

Heat treatment apparatus and heat treatment method

The clamp apparatus of the present disclosure includes a clamp member configured to contact a substrate accommodating container from an upper side and fix the substrate accommodating container to a predetermined position when a cover provided on a front surface of the substrate accommodating container is opened/closed, a driving mechanism configured to drive the clamp member; a casing configured to cover the driving mechanism, a suction port configured to communicate with the casing, an exhaust chamber provided near the casing, and a fan provided inside the exhaust chamber.

Clamp apparatus, substrate carry-in/out apparatus using the same, and substrate processing apparatus

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Iwate, Japan

Norio Baba