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Jenoptik Gmbh

Jenoptik Optical Systems Gmbh

Janunts, Norik

Norik Janunts

Tobias Gnausch

Armin Grundmann

Robert Buettner

Thomas Kaden

Christian Karras

Robert BÜTTNER

A method for the testing of optoelectronic chips which are arranged on a wafer and have electrical interfaces in the form of contact pads and optical interfaces which are arranged to be fixed relative thereto in the form of optical deflection elements, e.g., grating couplers, with a specific coupling angle. The wafer is adjusted in three adjustment steps with one of the chips relative to a contacting module such that the electrical interfaces of the chip and contacting module contact one another, and the optical interfaces of the chip and contacting module occupy a maximum position of the optical coupling.

Wafer-level test method for optoelectronic chips

The invention is directed to an arrangement for detecting the intensity distribution of components of the electromagnetic field in beams of radiation. The object of the invention is met, according to the invention, in that a high-resolution two-dimensional intensity sensor array and a field vector detector array comprising different regions with individual detector structures for two transverse and longitudinal field vector components E, E, Eare combined, wherein the detector structures are formed as nanostructures, metallic jacket-shaped tips with different apices, for utilization of localized plasmon resonance (LPR) of the individual detector structures and localized surface plasmons (LSP) excited through LPR for a polarization selection of the field distribution according to field vector components E, E, Eand transmission thereof to associated sensor elements by means of surface plasmon polaritons (SPP) and wave guiding (WGM).

Assembly for detecting the intensity distribution of components of the electromagnetic field in beams of radiation

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Jena, Germany

Norik Janunts