Tokyo Electron Limited

Norihiro Itoh

Kazuhiro Aiura

Jiro Higashijima

Yuki Ito

Naoki Shindo

Hiromitsu Nanba

Yusuke Hashimoto

Takashi Nagai

Yosuke Hachiya

Hidemasa Aratake

Hiroyuki Kudoh

A substrate cleaning apparatus includes: a support part configured to support a substrate by bring into contact with a rear surface of the substrate; an annular member disposed to surround a periphery of the substrate supported on the support part and including an inclined surface that is inclined with respect to a horizontal plane in a diametrical direction of the annular member; a rotation part configured to rotate the support part and the annular member; a first supply part configured to supply a cleaning liquid toward the rear surface of the substrate supported on the support part; and a second supply part configured to supply the cleaning liquid toward the inclined surface.

Substrate cleaning apparatus, substrate cleaning method, and non-transitory computer-readable recording medium

A liquid treatment apparatus includes a substrate retaining unit, a rotational driving unit configured to rotate the substrate retaining unit; and a nozzle disposed below a lower surface of the substrate, the nozzle having first ejection ports provided to eject a chemical liquid and second ejection ports provided to eject a rinsing fluid towards the lower surface of the substrate. The nozzle comprises a first portion and a second portion each extending from a position opposing to a peripheral portion of the substrate towards a position opposing to a central portion of the substrate. At least part of the first ejection ports are arranged in the first portion. At least part of the second ejection ports are arranged in the second portion. The first portion and the second portion are arranged to form a V-shaped figure.

Liquid treatment apparatus and method

The liquid treatment apparatus according to the present invention includes a substrate holder configured to horizontally hold a substrate, and a top plate configured to be rotatable and to cover the substrate held by the substrate holder from above so as to define a treatment space. In the treatment space, a chemical liquid is supplied by a chemical liquid nozzle onto the substrate, and an atmosphere replacement gas is supplied by a replacement nozzle into the treatment space. The replacement nozzle is supported by a replacement nozzle support arm configured to be horizontally moved between an advanced position at which the replacement nozzle support arm is advanced into the treatment space and a retracted position at which the replacement nozzle support arm is retracted outside from the treatment space. The replacement nozzle is configured to discharge, above the substrate, the atmosphere replacement gas upward.

Liquid treatment apparatus and liquid treatment method

Disclosed are a liquid processing apparatus and a liquid processing method that can prevent a substrate in a processing chamber from being contaminated due to contamination attached to a nozzle supporting arm that supports a nozzle. The liquid processing apparatus of the present disclosure includes: a processing chamber having a substrate holding unit configured to hold a substrate and a cup disposed around the substrate holding unit; a nozzle configured to supply a fluid to the substrate held by the substrate holding unit; and a nozzle supporting arm configured to support the nozzle. An arm cleaning unit configured to clean the nozzle supporting arm is installed in the liquid processing apparatus.

Liquid arm cleaning unit for substrate processing apparatus

A liquid processing apparatus includes a substrate retaining part that retains a substrate in a horizontal position and rotates the substrate, first and second processing liquid supply nozzles disposed to supply first and second processing liquids, respectively, to the substrate, liquid receiving cups disposed to appropriately position an upper end thereof above the substrate and to receive the first or second processing liquid that has been supplied to the substrate, a first tubular outer cup including an upper opening and disposed around the liquid receiving cup, vertically movable between a lifted position to which the first tubular outer cup is lifted so that its upper end is positioned above the liquid receiving cup, and a lowered position lower than the lifted position, and a second tubular outer cup disposed externally to the first tubular outer cup. The tubular outer cup is selected according to the kind of processing liquid.

Liquid processing apparatus and liquid processing method

There is provided a liquid processing apparatus capable of efficiently processing a pattern formation surface of a wafer, while preventing diffusion of a chemical-liquid atmosphere which might possibly occurs during a chemical-liquid process.

Substrate liquid processing apparatus, liquid processing method, and storage medium

Provided is a substrate processing apparatus in which flexibility of disposing a device configured to determine a holding state of a substrate and the flexibility of timing of determining the holding state are enhanced. The substrate processing apparatus includes a light projector configured to radiate detection light toward a region where a substrate may exist when the substrate is held by a substrate holding member and a light receiver configured to receive the detection light radiated from the light projector. A light path of the detection light from the light projector toward the light receiver passes a substrate surrounding member installed around the substrate held by the substrate holding member. The detection light penetrates the substrate surrounding member and has a wavelength which does not penetrate the substrate.

Substrate processing apparatus and substrate processing method

A liquid treatment method including: retaining a substrate with a treatment target surface being set as a lower surface, and rotating the substrate; supplying DIW (deionized water) to the lower surface of the substrate, thereby performing a rinsing process to the substrate; and thereafter supplying a mist containing IPA (isopropyl alcohol) and Ngas, thereby substituting the IPA for the DIW. The supplying of the mist is performed using a nozzle positioned below the substrate, the nozzle comprising a plurality of ejection ports which are arrayed between a position opposing a central portion of the substrate and a position opposing a peripheral portion of the substrate.

A liquid processing apparatus, capable of preventing a cleaning solution from remaining on a lifting member of a target object, thereby preventing an attachment of a cleaning solution to an opposite surface of a target object, and preventing an inflow of the cleaning solution into an inert gas supply part to efficiently supply the inert gas to the object, is disclosed. The liquid processing apparatus includes a hollow-shaped support plate to support an object, a hollow-shaped rotary shaft fixedly connected to the support plate, a rotary drive part to rotate the rotary shaft in a predetermined rotating direction, and a lift pin plate arranged in a hollow of the support plate to have lift pins supporting a main body and the processed object. A cleaning solution supply part to supply a cleaning solution and an inert gas supply part to supply an inert gas are extended in a hollow of the rotary shaft. The lift pin plate includes an inclined surface, and the front end of the inert gas supply part is positioned in a position higher than that of the front end of the cleaning solution supply part.

Liquid processing apparatus

There is provided a substrate processing method of supplying a processing solution to a substrate through a supply nozzle connected with a supply path via a differential pressure flowmeter provided on the supply path for supplying the processing solution and performing a process on the substrate by the processing solution. The substrate processing method includes measuring a pressure value in the supply path by a pressure measurement unit included in the differential pressure flowmeter when the processing solution is not supplied to the substrate; determining whether the pressure measurement unit is operated normally by comparing the pressure value measured in the measuring process with a predetermined pressure value; and supplying the processing solution to a substrate if it is determined that the pressure measurement unit is operated normally in the determining process.

Substrate processing method, storage medium storing program for executing the same, substrate processing apparatus, and fault detection method for differential pressure flowmeter

A liquid processing apparatus and method capable of separately collecting first and second processing liquids from each other, and preventing a formation of a defect (such as watermarks and particles) on a target substrate are disclosed. In one embodiment, the liquid processing apparatus includes a substrate holding device, a processing liquid supply device to supply a first processing liquid and a second processing liquid, a rotating cup, an outer discharge portion and an inner discharge portion to respectively discharge the first processing liquid and the second processing liquid received from the first receiving surface of the rotating cup, and a discharge portion switch device to open/close the outer discharge portion. The lower end of the first receiving surface of the rotating cup extends to a lower position than the position of the substrate held by the substrate holding device. The first processing liquid is discharged toward the outer discharge portion when the discharge portion switch device moves up, and the second processing liquid is discharged toward the inner discharge portionwhen the discharge portion switch device moves down.

Liquid processing apparatus, liquid processing method and storage medium

There is provided a substrate processing apparatus capable of stably holding a substrate and properly processing the substrate. The substrate processing apparatus is an apparatus that processes a substrate while rotating the substrate, with a place surface of the substrate being oriented in a horizontal direction. The substrate processing apparatus comprises a table including a rotatable base plate having a plurality of projecting members projected outward, and a rotation driving mechanism that rotates the base plate. The table can rotatably hold the substrate such that the projecting members contact the substrate from below with a gap formed between the substrate and the table. The substrate processing apparatus further comprises a pressure adjusting apparatus including a suction duct line having one end thereof being opened to the gap, and a suction mechanism connected to the other end of the suction duct line.

Growing community of inventors

Koshi, Japan

Norihiro Itoh