Tokyo Electron Limited

Norihiro Ito

Jiro Higashijima

Kazuhiro Aiura

Hiromitsu Nanba

Terufumi Wakiyama

Satoshi Kaneko

Takashi Nagai

Yosuke Hachiya

Masami Akimoto

Takayuki Toshima

Naoki Shindo

Nobuhiro Ogata

Kazuhisa Matsumoto

Yuji Kamikawa

Teruomi Minami

Tadashi Iino

Yusuke Hashimoto

Yasuhiro Chouno

Satoru Tanaka

Takehiko Orii

Hiroshi Tanaka

Hiroki Ohno

Kenji Sekiguchi

Shuichi Nagamine

Osamu Kuroda

Yuichi Douki

Itaru Kanno

Yusuke Saito

Mitsunori Nakamori

Takahisa Otsuka

Hisashi Kawano

Yosuke Kawabuchi

Kazuyoshi Shinohara

Meitoku Aibara

Kazuki Kosai

Keigo Satake

Yasushi Fujii

Takashi Yabuta

Fumihiro Kamimura

Satoshi Biwa

Yuki Yoshida

Daisuke Goto

Hidemasa Aratake

Kotaro Ooishi

Hidetoshi Nakao

Yoshichika Tokuno

Jun Nogami

Takeshi Uno

Hiroaki Kawaguchi

Tsuyoshi Fukushima

A liquid processing apparatus according to an embodiment includes a holding unit, a driving unit, a shaft, and a nozzle. The driving unit rotates the substrate and the holding unit that horizontally holds the substrate. The shaft is extended along an axial direction of a rotation axis. The nozzle includes a base that is attached to an upper end of the shaft, and a liquid supply unit that is extended from the base to a radial-direction outer side of the substrate and includes discharge ports formed to discharge the liquid toward a lower surface of the substrate. The shaft and the base are configured to include a discharge passage that is formed along the axial direction to discharge the liquid discharged toward the lower surface of the substrate. The base includes a concave portion that is concave downward to cause the liquid to flow toward the discharge passage.

Liquid processing apparatus

A substrate processing apparatus includes a stationary cup bodyprovided to surround a substrate holding unitand configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard; and a guard elevating mechanismconfigured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portionof a cylindrical shape and a protruding portionprotruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.

Substrate processing apparatus, substrate processing method and recording medium

After a discharge of a processing liquid is stopped, a position of a liquid surface within a nozzle can be observed. A substrate processing apparatus includes a substrate holding mechanism and the nozzle. The substrate holding mechanism is configured to hold a substrate. The nozzle is configured to supply the processing liquid to the substrate. The nozzle includes a pipe member and an observation window. The pipe member has a horizontal part and a downward part extended downwards from the horizontal part, and is configured to discharge the processing liquid from a tip end of the downward part. The observation window is provided at the horizontal part of the pipe member.

Substrate processing apparatus and nozzle

According to the present disclosure, both first and second cup bodies are brought into a state of being close to each other by lifting one of the first and second cup bodies. A first gap between a gap forming portion formed on the lower surface of a first protruding portion and the upper surface of a second protruding portion is narrower than a second gap between a portion of the first protruding portion where the gap forming portion is absent, and the upper surface of the second protruding portion. In this state, a cleaning liquid is supplied to the second gap. Since movement of the cleaning liquid that tends to flow radially outward is restricted by the first narrow gap, the entire area between the first and second protruding portions may be filled with the cleaning liquid so that the surface to be cleaned may be evenly cleaned.

Substrate processing apparatus, method of cleaning substrate processing apparatus, and storage medium

A substrate processing apparatus can suppress a rear surface of a substrate from being contaminated when moving the substrate and a liquid supply unit upwards. When a lift pinand a liquid supply pipeare moved from a neighboring position where they are adjacent to a holding plateto a distanced position, an elevating deviceraises only the lift pinfor a time during which the first lifting memberis moved up to a preset position while being connected to the lift pin. The elevating deviceraises the lift pinand the liquid supply pipefor a time during which the first lifting memberis raised from the preset position to the distanced position.

Substrate processing apparatus

A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.

A substrate processing system includes: a holding plate provided to be rotatable around a vertical axis; a substrate holding member provided on the holding plate to hold a substrate; a rotary drive unit that rotates the substrate in a predetermined direction; and a processing fluid supply unit that supplies a processing liquid to the substrate. The substrate holding member includes a first side portion provided at a position facing the substrate and a second side portion and a third side portion that are adjacent to the first side portion. The first side portion includes a gripping portion configured to grip an end surface of the substrate. The second side portion forms a pointed end portion with the first side portion, and includes a liquid flow guide portion that guides the processing liquid to a lower side of the substrate after the processing liquid is supplied to the substrate.

Substrate processing system

A substrate liquid processing apparatus of the present disclosure supplies a plurality of processing liquids from a processing liquid supplying unit in a switching manner to a substrate held on a substrate holding unit. An elevatable inner cup surrounds the substrate holding unit laterally and forms a first drain path that drains the first processing liquid. An outer cup surrounds the inner cup and forms a second drain path that drains the second processing liquid. A cover covers the outside of the outer cup, includes an eaves portion that extends inwardly from an upper side, and forms an exhaust path between the cover and the outer cup. The exhaust path is connected to the first drain path and the second drain path above inlets of the first drain path and the second drain path.

Substrate liquid processing apparatus

A heating processing performed on an outer peripheral portion of a substrate can be optimized. A substrate processing apparatus includes a holding unit configured to hold a substrate; a rotation unit configured to rotate the holding unit; a processing liquid supply unit configured to supply a processing liquid onto the substrate held in the holding unit; and a heating device configured to heat an outer peripheral portion of the substrate held in the holding unit. Further, the heating device includes a discharge flow path through which a gas is discharged toward the outer peripheral portion of the substrate held in the holding unit; a branch flow path through which a gas is discharged toward a region other than the substrate held in the holding unit; and a heating unit configured to heat the discharge flow path and the branch flow path.

Substrate processing apparatus, substrate processing method, and recording medium

A liquid treatment apparatus includes a substrate holder () that holds a substrate horizontally and rotates the substrate, a treatment liquid nozzle () that supplies a treatment liquid to the substrate held by the substrate holder, a cup () that is arranged outside of a peripheral edge of the substrate held by the substrate holder and receives the treatment liquid which has been supplied to the substrate by the treatment liquid nozzle, a top plate () that covers the substrate held by the substrate holder from above, a top plate rotation driving mechanism that rotates the top plate, and a liquid receiving member () that surrounds a peripheral edge of the top plate and has a circular liquid receiving space ().

Liquid treatment apparatus

A substrate processing apparatus includes a rotary cup that is provided at a substrate holding unit to surround a substrate held thereon and to be rotated along with the substrate holding unit, and configured to guide a processing liquid dispersed from the substrate; and an outer cup that is provided around the rotary cup with a gap therebetween and configured to collect the guided processing liquid by the rotary cup. Further, a height of an upper end of the rotary cup is higher than that of the outer cup. Furthermore, an outward protrusion protruded outwards in a radial direction thereof and extended along a circumference thereof is provided at an upper end portion of an outer surface of the rotary cup, and the outward protrusion blocks mist of the processing liquid dispersed from the gap between the rotary cup and the outer cup toward a space above the substrate.

Disclosed are a liquid processing apparatus and a liquid processing method. The liquid processing apparatus includes an ejection port ejecting a first liquid to a wafer, a first liquid supply mechanism supplying sulphuric acid to the ejection port, and a second liquid supply mechanism supplying hydrogen peroxide solution to the ejection port. The first liquid supply mechanism includes a first temperature adjustment mechanism maintaining the first liquid heated to a first temperature, a second temperature adjustment mechanism connected to the first temperature adjustment mechanism, and an ejection line connecting the second temperature adjustment mechanism with the ejection port. The second temperature adjustment mechanism includes a second circulation line and a second heater. The ejection line connects the second circulation line through a switching valve at a location further downstream than the second heater.

Liquid processing apparatus, liquid processing method and storage medium

A top plate is provided with a top plate rotation mechanism configured to rotate the top plate in a horizontal plane. An outside cup peripheral case disposed around a cup is configured to move between an upper position, in which a top end of the cylinder is positioned above the cup, and a lower position located below the upper position. A nozzle support arm configured to support a nozzle is moved, in a horizontal direction, between an advanced position, in which the arm is advanced into the outside cup peripheral case via a side opening formed in a side surface of the outside cup peripheral case when the cylinder is located in the upper position, and a retracted position, in which the arm is retracted outward from the outside cup peripheral case.

Liquid process apparatus and liquid process method

A liquid treatment apparatus includes a substrate holding member that holds a substrate horizontally, a rotation mechanism that rotates the substrate holding member; a chemical liquid nozzle that supplies a chemical liquid to the substrate held by the substrate holding member; a top plate that covers the substrate held by the substrate holding member from above the substrate; and at least one LED lamp that heats the substrate during a chemical liquid treatment by irradiating the substrate with light of a predetermined wavelength through the top plate from above the top plate.

Liquid treatment apparatus and liquid treatment method

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Koshi, Japan

Norihiro Ito